公开(公告)号：USD419133S

公开(公告)日：2000-01-18

申请号：US95184

申请日：1998-10-19

Applicant: Tooru Yoshida ,  Iwao Ishibashi

Designer： Tooru Yoshida ,  Iwao Ishibashi

公开(公告)号：US07215886B2

公开(公告)日：2007-05-08

申请号：US10222163

申请日：2002-08-15

Applicant: Shigenobu Maruyama ,  Kazumi Kawamoto ,  Hiroaki Furuichi ,  Tooru Yoshida ,  Isamu Yoshida ,  Katsuya Oono ,  Osamu Yamada ,  Hiroshi Ibe ,  Shigeru Tokita ,  Tarou Tonoduka ,  Yasunori Iwafuji ,  Katsumi Kuroguchi

Inventor： Shigenobu Maruyama ,  Kazumi Kawamoto ,  Hiroaki Furuichi ,  Tooru Yoshida ,  Isamu Yoshida ,  Katsuya Oono ,  Osamu Yamada ,  Hiroshi Ibe ,  Shigeru Tokita ,  Tarou Tonoduka ,  Yasunori Iwafuji ,  Katsumi Kuroguchi

IPC: H04B10/00 ,  G02B6/36 ,  H01L33/00

CPC classification number: H01S5/02212 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/024 ,  H01S5/0427 ,  H01S5/0683 ,  H01L2924/00 ,  H01L2924/01033

Abstract: The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50Ω.

Abstract translation: 本发明涉及一种用于在光学元件和外部电路之间传输高频信号（例如，10Gbit / s和更高数据速率）的光通信模块。 在说明性实施例中，光通信模块包括形成在陶瓷基板，柔性布线板和印刷电路板上的信号传输线和接地线。 信号线和接地线的宽度以及信号和接地线之间的间距变化。 这有助于信号线之间的特征阻抗匹配在约50mega以内。

公开(公告)号：US5811877A

公开(公告)日：1998-09-22

申请号：US829144

申请日：1997-03-31

Applicant: Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

Inventor： Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

IPC: H01L21/50 ,  H01L21/56 ,  H01L21/70 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L23/48 ,  H01L25/18

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.

Abstract translation: 一种超薄树脂模制半导体器件，可靠性高，成本低，安装时易于维修。 多个这些半导体器件被堆叠以提供具有比相同体积的半导体器件更高功能的半导体模块，并且提供利用由堆叠的半导体模块组装的卡型模块。 在制造半导体模块时，将极薄的引线框架和LSI芯片直接连接在一起，并且通过使用低粘度环氧树脂来暴露LSI芯片的镜面以具有薄的成型。 研磨镜面以使半导体器件的整个结构具有更薄的厚度。 引线框架的一部分形成为加强构件，散热路径，用于屏蔽LSI免受有害光束的遮光部分或用于安装基板的定位基座。 上述超薄树脂模制半导体器件以堆叠的布局互连在一起以提供堆叠的半导体模块，并且提供具有更高功能的卡型设备。

公开(公告)号：US4351922A

公开(公告)日：1982-09-28

申请号：US179609

申请日：1980-08-19

Applicant: Tooru Yoshida ,  Seigo Iwagami ,  Takashi Ueshima ,  Yoshikazu Hosoda

Inventor： Tooru Yoshida ,  Seigo Iwagami ,  Takashi Ueshima ,  Yoshikazu Hosoda

IPC: A61F13/53 ,  A61F13/15 ,  A61F13/49 ,  A61L15/60 ,  B01D53/28 ,  B01J19/06 ,  B01J20/26 ,  B01J20/285 ,  C08F2/00 ,  C08F2/10 ,  C08F20/00 ,  C08F20/52 ,  C08F220/00 ,  C08F220/02 ,  C08F220/04 ,  C08F220/54 ,  C08F222/10 ,  C08F283/10 ,  C08F290/00 ,  C08F290/06 ,  C08F291/10 ,  C08F299/00 ,  C08F299/02 ,  G01N30/88 ,  C08L63/00 ,  C08F20/20 ,  C08F120/20

CPC classification number: A61L15/60 ,  B01J19/06 ,  C08F2/00 ,  C08F2/10 ,  C08F20/00 ,  C08F220/04 ,  C08F222/1006 ,  C08F283/10 ,  C08F290/06 ,  C08F290/062 ,  C08F291/10 ,  C08F299/024 ,  Y10S526/93

Abstract: A highly water-absorbing but less water-soluble hydrogel is produced by polymerizing at least one hydrophilic ethylenically unsaturated monomer, e.g., ethylenically unsaturated carboxylic acid, ethylenically unsaturated sulfonic acid, or derivatives thereof, in the presence of a specific difunctional compound, e.g., polyethyleneglycol diglycidyl ether, polyethyleneglycol diacrylate, etc.

Abstract translation: 通过在特定的双官能化合物的存在下聚合至少一种亲水性烯键式不饱和单体，例如烯键式不饱和羧酸，烯键式不饱和磺酸或其衍生物来制备高吸水性但是较少的水溶性水凝胶， 聚乙二醇二缩水甘油醚，聚乙二醇二丙烯酸酯等