公开(公告)号：US5811877A

公开(公告)日：1998-09-22

申请号：US829144

申请日：1997-03-31

申请人： Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

发明人： Ichiro Miyano ,  Ikuo Kawaguchi ,  Kunio Matsumoto ,  Junichi Saeki ,  Tooru Yoshida ,  Naoya Kanda ,  Isamu Yoshida ,  Michifumi Kawai ,  Hideo Yamakura ,  Shigeharu Tsunoda ,  Ritsuro Orihashi ,  Masachika Masuda ,  Sueo Kawai

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/70 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L23/48 ,  H01L25/18

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/3511

摘要： An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.

摘要翻译： 一种超薄树脂模制半导体器件，可靠性高，成本低，安装时易于维修。 多个这些半导体器件被堆叠以提供具有比相同体积的半导体器件更高功能的半导体模块，并且提供利用由堆叠的半导体模块组装的卡型模块。 在制造半导体模块时，将极薄的引线框架和LSI芯片直接连接在一起，并且通过使用低粘度环氧树脂来暴露LSI芯片的镜面以具有薄的成型。 研磨镜面以使半导体器件的整个结构具有更薄的厚度。 引线框架的一部分形成为加强构件，散热路径，用于屏蔽LSI免受有害光束的遮光部分或用于安装基板的定位基座。 上述超薄树脂模制半导体器件以堆叠的布局互连在一起以提供堆叠的半导体模块，并且提供具有更高功能的卡型设备。

公开(公告)号：US4987474A

公开(公告)日：1991-01-22

申请号：US536932

申请日：1990-06-12

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Asao Nishimura ,  Naozumi Hatada ,  Sueo Kawai ,  Makoto Kitano ,  Hideo Miura ,  Akihiro Yaguchi ,  Gen Murakami

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Asao Nishimura ,  Naozumi Hatada ,  Sueo Kawai ,  Makoto Kitano ,  Hideo Miura ,  Akihiro Yaguchi ,  Gen Murakami

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

摘要： In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.

摘要翻译： 在放置或放置在树脂成型包装体中的放大或放大的半导体芯片时，用于放置内部引线的空间被充分地固定的无引线框架中，为了增加占空比的目的，提供通孔 树脂部分。 此外，与颗粒的下表面相对应的每个引线在其宽度方向上分支成多个部分，以便减小应力。 此外，在介于引线和芯片之间的绝缘片中，其较短侧面的尺寸被设定为小于颗粒的较短侧面的尺寸，以防止在端部的端部发生裂纹 绝缘片。

公开(公告)号：US08653647B2

公开(公告)日：2014-02-18

申请号：US12801896

申请日：2010-06-30

申请人： Masachika Masuda ,  Chikao Ikenaga

发明人： Masachika Masuda ,  Chikao Ikenaga

IPC分类号： H01L23/48

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor device provided with terminal pads connected to the inner terminals with bond wires; and a resin molding sealing the terminal members, the semiconductor device and the bond wires therein. The inner terminals of the terminal members are thinner than the outer terminals and have contact surfaces. The upper, the lower and the outer side surfaces of the outer terminals, and the lower surfaces of the semiconductor device are exposed outside. The inner terminals, the bond wires, the semiconductor device and the resin molding are included in the thickness of the outer terminals.

摘要翻译： 塑料包装件包括多个端子构件，每个端子构件具有外端子，内端子和连接外端子和内端子的连接部件; 半导体器件，其具有用接合线连接到内部端子的端子焊盘; 以及密封端子部件，半导体器件和接合线的树脂成型体。 端子构件的内部端子比外部端子薄，并且具有接触表面。 外部端子的上部，下部和外侧表面以及半导体器件的下表面暴露在外部。 内端子，接合线，半导体器件和树脂模制件包括在外端子的厚度中。

公开(公告)号：US20120175759A1

公开(公告)日：2012-07-12

申请号：US13403616

申请日：2012-02-23

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/495

CPC分类号： H01L23/485 ,  H01L23/36 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

摘要翻译： 本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。 布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。 布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。 铜布线层包括第一端子，第二端子和布线部分。 第一端子与电极连接。 第二端子与外部接线装置连接。 布线部将第一端子与第二端子连接。

公开(公告)号：US07633146B2

公开(公告)日：2009-12-15

申请号：US12033170

申请日：2008-02-19

申请人： Masachika Masuda ,  Toshihiko Usami

发明人： Masachika Masuda ,  Toshihiko Usami

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  B82Y10/00 ,  G06K19/077 ,  G06K19/07732 ,  G11C5/02 ,  H01L22/32 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/5388 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/074 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Detachably mountable memory card featuring a memory chip(s) and a control chip includes a substrate of an insulating material, conductive layers provided on a first main surface of the substrate, a plurality of external electrode terminals exposed to the opposing, second main surface of the substrate, and conductive portions electrically connecting the conductive layers with corresponding ones of the external electrode terminals. The memory chip(s) and the control chip are electrically connected with ones of the conductive layers. The memory card also includes an encapsulating insulating layer covering the first main surface of the substrate, the fixedly disposed memory and control chips thereon, and the conductive layers, the encapsulating insulating layer having an exposed flat surface representing one main plane surface of the finished memory card, and the second main surface of the substrate representing another main plane surface of the memory card with the exposed external electrode terminals.

摘要翻译： 具有存储芯片和控制芯片的可拆卸安装的存储卡包括绝缘材料的基板，设置在基板的第一主表面上的导电层，暴露于相对的第二主表面的多个外部电极端子 所述基板和将所述导电层与对应的所述外部电极端子电连接的导电部分。 存储芯片和控制芯片与导电层中的一个电连接。 存储卡还包​​括覆盖基板的第一主表面的封装绝缘层，其上的固定设置的存储器和控制芯片，以及导电层，封装绝缘层具有表示成品存储器的一个主平面的暴露的平坦表面 卡，并且表示存储卡的另一个主平面的露出的外部电极端子的基板的第二主表面。

公开(公告)号：US20090283885A1

公开(公告)日：2009-11-19

申请号：US12508089

申请日：2009-07-23

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H01L23/00

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的具有突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成为可更换的 方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US20090189263A1

公开(公告)日：2009-07-30

申请号：US12318955

申请日：2009-01-13

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/52 ,  H01L23/498

CPC分类号： H01L23/485 ,  H01L23/36 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

摘要翻译： 本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。 布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。 金属基板设置在绝缘层的一侧。 铜布线层设置在绝缘层的另一侧。 布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。 铜布线层包括第一端子，第二端子和布线部分。 第一端子与设置在半导体芯片上的电极连接。 第二端子与外部接线装置连接。 布线部将第一端子与第二端子连接。

公开(公告)号：US20090146280A1

公开(公告)日：2009-06-11

申请号：US12095014

申请日：2006-11-28

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  C23F1/00

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件20包括具有管芯焊盘3的引线框架材料1，与半导体芯片30电连接的引线部分6和被配置为支撑管芯焊盘和引线部分的外框架2。 引线框架材料包括树脂密封区域9.在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm或更大的粗化面10A至10C和11A至11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层13和Pd镀层14而形成的双层镀层12A，或通过层压Ni镀层13，Pd镀层14和镀Au的三层镀层12B 层15以此顺序形成在引线框架材料的整个表面上。

公开(公告)号：US07294918B2

公开(公告)日：2007-11-13

申请号：US11431072

申请日：2006-05-10

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  G06F1/16 ,  H01R24/00

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

公开(公告)号：US20060033191A1

公开(公告)日：2006-02-16

申请号：US11203969

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。