摘要:
An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon.
摘要:
Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.
摘要:
A light source is disclosed. The light source has a light-emitting chip that includes an LED that generates light in an active region thereof. The LED emits a light signal in a forward direction, and infrared radiation generated in the active region is emitted in a side direction in the form of a first infrared signal. The first light signal is determined by a first drive signal coupled to the LED. The light source also includes an infrared detector positioned to collect a portion of the infrared signal. The infrared detector generates a heat signal indicative of the amount of infrared radiation detected. A controller generates the drive signal so as to maintain the heat signal at a first target value. In light sources having LEDs that emit in different spectral ranges, the infrared detectors can all detect heat in the same spectral range.
摘要:
An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon.
摘要:
An apparatus is directed to providing backlighting utilizing luminescent impregnated material. The apparatus includes a radiation source providing a first radiation and a filter layer optically coupled to the radiation source including a luminescent material designed to absorb the first radiation, and emit one or more radiations. The apparatus further includes a light guide optically coupled to the filter layer and designed to receive the emitted radiation and reflect at least a portion of the emitted radiation. The apparatus additionally includes a display layer optically coupled to the light guide and designed to receive the reflected radiation. The system provides means for providing a first radiation, means for absorbing the first radiation, means for emitting one or more radiations based on the absorbed first radiation, means for receiving the emitted radiation, means for reflecting the emitted radiation, and means for receiving the reflected emitted radiation.
摘要:
An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon.
摘要:
A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.
摘要:
A method of forming a semiconductor structure chemically-mechanically polishes (CMP) a semiconductor structure before applying a sealant layer over the porous low-k dielectric. The process of applying the sealant layer is a selective process that causes the sealant to adhere to or deposit onto the porous low-k dielectric and to not adhere to the copper conductors. After the sealant layer is formed, the cap is applied. The parylene layer seals the pores in the low-k dielectric which prevents the low-k dielectric layer from being damaged during the cap pre-cleaning process and also prevents the cap material from penetrating into the low-k dielectric.
摘要:
A system and method for a reverse mounted light array. In one method embodiment, the present invention couples a reverse mounted light-generating source with a substrate. Additionally, the present invention couples an electrical portion of the reverse mounted light generating source with a conductive trace coupled to the reverse side of the substrate, wherein the coupling of the conductive trace with the substrate and the reverse mounted light generating source forms a reverse mounted light array.
摘要:
An illumination unit includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.