Color management system
    5.
    发明授权
    Color management system 有权
    色彩管理系统

    公开(公告)号:US07938557B2

    公开(公告)日:2011-05-10

    申请号:US11020998

    申请日:2004-12-23

    IPC分类号: B60Q1/26

    摘要: A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.

    摘要翻译: 公开了一种光源及其操作方法。 光源包括光发射器和控制器。 光发射器响应于耦合到其的控制信号而产生光。 光发射器的特征在于与由光发射器累积产生的光量相关的年龄,对于给定的控制信号随着年龄的变化而产生的光。 控制器测量光发射器的年龄,并根据所需的光强度和发光体的测量年龄产生控制信号。 在一个实施例中,控制器存储光发射器的老化值,并且控制器响应于指定来自光发射器的期望光强度的输入信号来确定控制信号,控制器在每次控制信号为 决心。

    Semiconductor device with a light emitting semiconductor die
    9.
    发明授权
    Semiconductor device with a light emitting semiconductor die 有权
    具有发光半导体管芯的半导体器件

    公开(公告)号:US09123869B2

    公开(公告)日:2015-09-01

    申请号:US13036829

    申请日:2011-02-28

    摘要: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

    摘要翻译: 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

    SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE
    10.
    发明申请
    SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE 有权
    具有发光半导体芯片的半导体器件

    公开(公告)号:US20110147788A1

    公开(公告)日:2011-06-23

    申请号:US13036829

    申请日:2011-02-28

    IPC分类号: H01L33/62

    摘要: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

    摘要翻译: 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。