Abstract:
According to one aspect of the disclosure, a planar substrate receives a plurality of conductive posts therein, which posts include an offset medial portion having a laterally projecting notch portion. Certain posts are arranged with their notch portions in coplanar relationship and in latching registration with an interior sidewall portion of a housing received over the posts. Accordingly, the housing provides an insulating receptacle shroud for the posts and is latchingly retained in place without a need for attachment to the substrate. The shroud is also provided with card guides connected thereto by integral hinge portions enabling alignment of, and reducing twisting and warping of, the card guides. The card guides are additionally coupled together with rails further reducing twisting and warping of the guides. The terminals are advantageously mounted in strip form for ease in manufacture and assembly to the substrate.
Abstract:
An inexpensive means for mounting large numbers of diodes on a circuit board to form a matrix comprising a series of inverted, U-shaped channels which are positioned side-by-side, in parallel arrangement, with each channel having a plurality of first holes therein. Each of these first holes are positioned over a smaller second hole in the board, with a small female receptacle either formed or inserted in each of said second holes. The U-shaped channels bridge over the small female receptacles without touching them. A diode having a first wire-like terminal is inserted down through each pair of concentric first and second holes so that its wire-like terminal fits into the small female receptacle. The conductive casing of the diode, which is connected to its second terminal, fits snugly within said first hole in said U-shaped channel and makes electrical contact with said channel.
Abstract:
A preloaded contact and latchable housing assembly including electrical contacts having one end which is adapted to be inserted within a P.C. board for wire-wrapping connections, while the other end is substantially U-shaped and includes leaf-spring type contact members which are adapted to be inserted within housing apertures. The housing includes means for automatically biasing the leaf-spring members apart when the same are inserted within the housing whereupon a resilient receptacle is formed for mating contact members which may also be inserted into the housing, and includes other means for automatically interlocking with projections disposed upon the leaf-spring contact members whereby the contact members and the housing may be integrally interlockingly engaged. The upper extremities of the contact members are curved outwardly so as to provide a funneled entrance upon the receptacle for the mating contacts, and the housing apertures are of such width as to prevent the insertion of a mating contact which will tend to overstress the resilient contact members.
Abstract:
A mating contact connector housing assembly having a plurality of contacts housed therein, the contacts including contact blade portions and terminal portions and being mounted within the housing in a cantilever manner such that they are restrained from moving within longitudinally extending planes yet are permitted to undergo flexural movement within laterally extending planes, whereby the contact members accomodate and compensate for contact misalignment with mating contact members. The housing is also provided with additional aligning pins to properly align the housing relative to a mating housing and is further provided with a dependent skirt which serves to additionally promote the alignment between the mating housing as well as protect the contact members against structural damage.
Abstract:
An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shapes of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.
Abstract:
A strip of heated terminal posts are attached to a common carrier and a vertically positioned ribbon of solder are supplied simultaneously to a first pair of rollers which presses the heated terminal posts into the edge of, but not through, the vertically positioned solder ribbon. Next, the strip of terminal posts, with the solder ribbon attached, is passed through a second set of rollers which crimp the solder ribbon together midway between terminal posts to force the solder further around the terminal posts, thereby ensuring that the same amount of solder will flow around each terminal post when the terminal posts are gang inserted in a printed circuit board and the solder melted.