Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems

    公开(公告)号:US10916451B2

    公开(公告)日:2021-02-09

    申请号:US16453740

    申请日:2019-06-26

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    CENTERFINDING FOR A PROCESS KIT OR PROCESS KIT CARRIER AT A MANUFACTURING SYSTEM

    公开(公告)号:US20220111529A1

    公开(公告)日:2022-04-14

    申请号:US17069431

    申请日:2020-10-13

    Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS

    公开(公告)号:US20190318940A1

    公开(公告)日:2019-10-17

    申请号:US16453740

    申请日:2019-06-26

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems

    公开(公告)号:US10361099B2

    公开(公告)日:2019-07-23

    申请号:US15632031

    申请日:2017-06-23

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Centerfinding for a process kit or process kit carrier at a manufacturing system

    公开(公告)号:US11813757B2

    公开(公告)日:2023-11-14

    申请号:US17069431

    申请日:2020-10-13

    CPC classification number: B25J9/1692

    Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

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