Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems

    公开(公告)号:US10916451B2

    公开(公告)日:2021-02-09

    申请号:US16453740

    申请日:2019-06-26

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Centerfinding for a process kit or process kit carrier at a manufacturing system

    公开(公告)号:US11813757B2

    公开(公告)日:2023-11-14

    申请号:US17069431

    申请日:2020-10-13

    CPC classification number: B25J9/1692

    Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS

    公开(公告)号:US20180374719A1

    公开(公告)日:2018-12-27

    申请号:US15632031

    申请日:2017-06-23

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    CENTERFINDING FOR A PROCESS KIT OR PROCESS KIT CARRIER AT A MANUFACTURING SYSTEM

    公开(公告)号:US20220111529A1

    公开(公告)日:2022-04-14

    申请号:US17069431

    申请日:2020-10-13

    Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS

    公开(公告)号:US20190318940A1

    公开(公告)日:2019-10-17

    申请号:US16453740

    申请日:2019-06-26

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

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