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公开(公告)号：US11170072B2
公开(公告)日：2021-11-09
申请号：US15558186
申请日：2016-03-25
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis Mos , Velislava Ignatova , Erik Jensen , Michael Kubis , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Erik Johannes Maria Wallerbos , Jochem Sebastiaan Wildenberg
Abstract: A method including evaluating, with respect to a parameter representing remaining uncertainty of a mathematical model fitting measured data, one or more mathematical models for fitting measured data and one or more measurement sampling schemes for measuring data, against measurement data across a substrate, and identifying one or more mathematical models and/or one or more measurement sampling schemes, for which the parameter crosses a threshold.
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公开(公告)号：US11061336B2
公开(公告)日：2021-07-13
申请号：US16493835
申请日：2018-03-28
Applicant: ASML NETHERLANDS B.V.
Inventor： Hubertus Johannes Gertrudus Simons , Everhardus Cornelis Mos , Xiuhong Wei , Reza Mahmoodi Baram , Hadi Yagubizade , Yichen Zhang
Abstract: A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.
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公开(公告)号：US09927717B2
公开(公告)日：2018-03-27
申请号：US15105517
申请日：2014-11-07
Applicant: ASML Netherlands B.V.
Inventor： Kyu Kab Rhe , David Deckers , Hubertus Johannes Gertrudus Simons , Thomas Theeuwes
IPC: G03F7/20
CPC classification number: G03F7/70616 , G03F7/70625 , G03F7/70633
Abstract: A method of correcting an image characteristic of a substrate onto which one or more product features have been formed using a lithographic process, and an associated inspection apparatus method. The method includes measuring an error in the image characteristic of the substrate, and determining a correction for a subsequent formation of the product features based upon the measured error and a characteristic of one or more of the product feature(s).
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Patent Agency Ranking
公开(公告)号：US09291916B2
公开(公告)日：2016-03-22
申请号：US14613687
申请日：2015-02-04
Applicant: ASML Netherlands B.V.
Inventor： Stefan Cornelis Theodorus Van Der Sanden , Richard Johannes Franciscus Van Haren , Hubertus Johannes Gertrudus Simons , Remi Daniel Marie Edart , Xiuhong Wei , Irina Lyulina , Michael Kubis
CPC classification number: G03F7/70616 , G03F7/70141 , G03F7/70633 , G03F9/7003 , G03F9/7088
Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.
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公开(公告)号：US20140089870A1
公开(公告)日：2014-03-27
申请号：US13963947
申请日：2013-08-09
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis MOS , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Nicole Schoumans , Michael Kubis , Paul Cornelis Hubertus Aben
IPC: G06F17/50
CPC classification number: G06F17/5081 , G03F1/36 , G03F7/70458 , G03F7/70525 , G03F7/70633
Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
Abstract translation: 一种计算光刻工具的处理校正的方法及相关装置。 该方法包括测量使用光刻工具预先暴露的衬底上的工艺缺陷数据; 将过程签名模型拟合到所测量的过程缺陷数据，以获得用于光刻工具的过程签名的模型; 并使用过程签名模型来计算光刻工具的过程校正。
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公开(公告)号：USRE49460E1
公开(公告)日：2023-03-14
申请号：US14637358
申请日：2015-03-03
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis Mos , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Nicole Schoumans , Michael Kubis , Paul Cornelis Hubertus Aben
IPC: G06F30/398 , G03F1/36 , G03F7/20
Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
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公开(公告)号：USRE49199E1
公开(公告)日：2022-09-06
申请号：US14629351
申请日：2015-02-23
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis Mos , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Nicole Schoumans , Michael Kubis , Paul Cornelis Hubertus Aben
IPC: G06F30/398 , G03F1/36 , G03F7/20
Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
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公开(公告)号：US08887107B2
公开(公告)日：2014-11-11
申请号：US13963947
申请日：2013-08-09
Applicant: ASML Netherlands B.V.
Inventor： Everhardus Cornelis Mos , Hubertus Johannes Gertrudus Simons , Peter Ten Berge , Nicole Schoumans , Michael Kubis , Paul Cornelis Hubertus Aben
CPC classification number: G06F17/5081 , G03F1/36 , G03F7/70458 , G03F7/70525 , G03F7/70633
Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
Abstract translation: 一种计算光刻工具的处理校正的方法及相关装置。 该方法包括测量使用光刻工具预先暴露的衬底上的工艺缺陷数据; 将过程签名模型拟合到所测量的过程缺陷数据，以获得用于光刻工具的过程签名的模型; 并使用过程签名模型来计算光刻工具的过程校正。
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