Method for manufacturing a semiconductor device
    1.
    发明授权
    Method for manufacturing a semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US4584055A

    公开(公告)日:1986-04-22

    申请号:US717173

    申请日:1985-03-19

    摘要: Utilizing the fact that an isotropic etching rate of a semiconductor layer such as a polycrystalline or amorphous silicon layer depends on a doped amount of an impurity doped into the semiconductor layer, the impurity is doped into a semiconductor layer (26) formed on a substrate (4) so as to have a concentration distribution in its thickness direction. Then, in a region of the semiconductor layer (26) to be selectively removed, an anisotropic etching is carried out such that a portion of high impurity concentration is removed and a portion thereof in the thickness direction is remained. Thereafter, the remained portion is subjected to an isotropic etching to thereby suppress the side etching.

    摘要翻译: PCT No.PCT / JP84 / 00367 Sec。 371日期:1985年3月19日 102(e)1985年3月19日PCT文件1984年7月19日PCT公布。 出版物WO85 / 00695 日期:1985年2月14日。利用诸如多晶或非晶硅层的半导体层的各向同性蚀刻速率取决于掺杂到半导体层中的杂质的掺杂量,将杂质掺杂到半导体层 26)形成在基板(4)上,以便在其厚度方向上具有浓度分布。 然后,在要选择性去除的半导体层(26)的区域中,进行各向异性蚀刻,使得去除高杂质浓度的一部分,并且残留其厚度方向的一部分。 此后,对残留部分进行各向同性蚀刻,从而抑制侧面蚀刻。

    Method for manufacturing a semiconductor device utilizing self-aligned
oxide-nitride masking
    2.
    发明授权
    Method for manufacturing a semiconductor device utilizing self-aligned oxide-nitride masking 失效
    利用自对准氧化物氮化物掩模制造半导体器件的方法

    公开(公告)号:US4591398A

    公开(公告)日:1986-05-27

    申请号:US700707

    申请日:1985-01-25

    摘要: The present invention is to provide a method for manufacturing a semiconductor device of high efficiency and high integration density. The method for manufacturing a semiconductor device comprises the steps of forming semiconductive layers (30), (31) and (31') having on the surface thereof a concave portion, forming a nitride layer (35) within the concave portions forming with the nitride layer (35) as a mask an oxide layer (39) on the surface of the semiconductive layer (30), removing said nitride layer (35) and introducing an impurity into the semiconductive layers (31) and (31') with the oxide layer (39) as a mask. In accordance therewith, the elements can be made finer and hence the method of this invention is suitable for manufacturing an IC device high in efficiency and high in integration density.

    摘要翻译: PCT No.PCT / JP84 / 00271 Sec。 371日期1985年1月25日第 102(e)日期1985年1月25日PCT申请日1984年5月25日PCT公布。 公开号WO84 / 04853 日期为1984年12月6日。本发明提供一种高效率,高集成度的半导体器件的制造方法。 半导体器件的制造方法包括以下步骤:在其表面上形成有凹部的半导体层(30),(31)和(31'),在形成氮化物的凹部内形成氮化物层(35) 层(35)作为掩模,在半导体层(30)的表面上形成氧化物层(39),去除所述氮化物层(35),并用氧化物将杂质引入半导体层(31)和(31') 层(39)作为掩模。 因此,可以使元件更细,因此本发明的方法适用于制造高效率和高集成度的IC器件。

    Gasoline vapor capture and combustion system
    3.
    发明授权
    Gasoline vapor capture and combustion system 失效
    汽油蒸汽捕集和燃烧系统

    公开(公告)号:US4658795A

    公开(公告)日:1987-04-21

    申请号:US745689

    申请日:1985-06-17

    IPC分类号: F02M9/06 F02M25/08 F02M39/00

    摘要: Vapors normally arising within a standing gasoline tank are captured in a charcoal filled cannister. When the engine is running, air is drawn through the cannister thereby purging gasoline adsorbed on the charcoal within the cannister and delivering the purged gasoline vapors to the carburetor ultimately for combustion within the engine. Interference by the presence of such accumulated gasoline vapors in the carburetor, particularly during warm restarts and idling, can be avoided by preventing the injection of these gasoline vapors into the carburetor at the inappropriate times. Selective withholding of the purged gasoline vapors from a piston type carburetor, having a piston throttle valve disposed into and out of a venturi portion of the carburetor, is accomplished by injecting the gasoline vapors into the venturi portion through a purge port within the carburetor at a point such that the leading edge and outside surface of the piston type throttle valve closes and seals the port when the throttle valve is in a fully closed position. Thus, during idling and warm restarts, when the throttle valve is closed, no evaporated vapors are allowed to fill the venturi portion of the carburetor. Purging of the gasoline adsorbed on the charcoal within the cannister is accelerated by increasing the effective area of the purge port as the throttle valve is opened.

    摘要翻译: 通常在站立的汽油罐中产生的蒸气被捕获在一个充满炭的罐中。 当发动机运行时,空气通过罐抽吸,从而清除吸收在罐内的木炭上的汽油,并将净化的汽油蒸汽输送到化油器以最终在发动机内燃烧。 通过防止在不合适的时间将这些汽油蒸气注入化油器,可以避免在化油器中存在这种累积汽油蒸汽的干扰,特别是在暖重启和空转期间。 通过设置在化油器的文丘里部分内的具有活塞节流阀的活塞式化油器选择性地扣留清除汽油的蒸汽是通过汽化器内的吹扫口将燃料蒸汽注入文丘里管部分而实现的 使得当节流阀处于完全关闭位置时,活塞式节流阀的前缘和外表面关闭并密封端口。 因此,在空转和暖启动期间,当节流阀关闭时,不允许蒸发的蒸气填充化油器的文氏管部分。 通过在打开节流阀时增加吹扫口的有效面积,可以加速吸附在罐内的炭上的汽油的清洗。

    Oxygen diffusion blocking semiconductor capacitor
    4.
    发明授权
    Oxygen diffusion blocking semiconductor capacitor 失效
    氧扩散阻塞半导体电容器

    公开(公告)号:US06407422B1

    公开(公告)日:2002-06-18

    申请号:US09556571

    申请日:2000-04-24

    IPC分类号: H01L27108

    摘要: Provided is a semiconductor memory device in which defective contact, deterioration in transistor characteristics and other problems are solved with a thermally stable, conductive diffusion barrier layer against oxygen, and against constituent elements in a plug material and a lower electrode, formed at the interface between a plug and the lower electrode made of a noble metal. The semiconductor memory device comprises a dielectric capacitor of a stacked structure including a first electrode (a lower electrode), a dielectric film and a second electrode (an upper electrode) and a conductive plug connected to the lower electrode, wherein the lower electrode connected to the conductive plug includes a metal suboxide layer with conductiveness and a diffusion barrier layer blocking diffusion of oxygen, and the metal suboxide layer and the diffusion barrier layer are stacked in the order from the conductive plug side of the lower electrode.

    摘要翻译: 提供了一种半导体存储器件,其中通过针对氧的热稳定的导电扩散阻挡层以及针对形成在插塞材料和下电极之间的界面处的构成元件来解决不良接触,晶体管特性劣化和其他问题 插头和由贵金属制成的下电极。 半导体存储器件包括具有第一电极(下电极),电介质膜和第二电极(上电极)和连接到下电极的导电插塞的堆叠结构的介质电容器,其中下电极连接到 导电插塞包括具有导电性的金属低氧化物层和阻挡氧的扩散的扩散阻挡层,并且金属低氧化物层和扩散阻挡层以下电极的导电插塞侧的顺序层叠。