摘要:
An apparatus for replacing consumables of a vacuum chamber. A unitary removable shield assembly is provided to quickly replace consumables such as a shield. The shield assembly can include an upper adapter assembly, at least one shield member, a cover ring and an insulator member. The shield assembly is designed so that the consumables can be replaced in one step and allows the chamber to continue with its maintenance cycle.
摘要:
A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.
摘要:
The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal and at least one moveable tilted target. Embodiments of the invention facilitate deposition of highly uniform thin films.
摘要:
The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal. Embodiments of the invention facilitate deposition of highly uniform thin films. In further embodiments, one or more sputtering targets are movably disposed above the pedestal. The orientation of the targets relative to the pedestal may be adjusted laterally, vertically or angularly. In one embodiment, the target may be adjusted between angles of about 0 to 45 degreees relative to an axis of pedestal rotation.
摘要:
The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal and at least one moveable tilted target. Embodiments of the invention facilitate deposition of highly uniform thin films.
摘要:
A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.
摘要:
A cleanroom lift for maneuvering large objects such as turbomolecular pumps utilized in semiconductor processing applications is provided. In one embodiment, the lift includes a vertically movable carriage coupled to a linkage assembly. The linkage assembly has a first link and a second link. Each link has one piece construction to minimize deflection under load. The first link is coupled to the carriage by a carriage shaft assembly and to the second link by a linkage shaft assembly. The second link is coupled to the linkage shaft assembly and a gripper assembly. Optionally, a third link and second shaft assembly may be disposed between the gripper assembly and the second link to minimize the weight of the links to facilitate assembly in cleanroom environments.
摘要:
A method of operating a mobile robot to traverse a threshold includes detecting a threshold proximate the robot. The robot includes a holonomic drive system having first, second, and third drive elements configured to maneuver the robot omni-directionally. The method further includes moving the first drive element onto the threshold from a first side and moving the second drive element onto the threshold to place both the first and second drive elements on the threshold. The method includes moving the first drive element off a second side of the threshold, opposite to the first side of the threshold, and moving the third drive element onto the threshold, placing both the second and third drive elements on the threshold. The method includes moving both the second and third drive elements off the second side of the threshold.
摘要:
In one embodiment, a target alignment surface disposed on a target support mechanically engages a darkspace shield alignment surface disposed on a darkspace shield as the target is lodged into a chamber body. The respective alignment surfaces are shaped and positioned so that the darkspace shield is physically moved to a desired aligned position as the alignment surfaces engage each other. In this manner a darkspace shield may be directly aligned to a target within a semiconductor fabrication chamber to provide a suitable darkspace gap between the target and the darkspace shield.