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公开(公告)号：US07465419B1
公开(公告)日：2008-12-16
申请号：US11440867
申请日：2006-05-24
申请人： Alfredo M. Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry J. Garino
发明人： Alfredo M. Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry J. Garino
IPC分类号： B29C33/00
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
摘要翻译： 提供了符合标准的悬臂三维微镜。 柔性悬臂微型适用于复制悬臂微型零件，大大简化了这种悬臂零件的复制。 柔性悬臂微型金属可用于使用铸造或电铸技术制造微型材料。 当柔性微型金属用于制造电铸悬臂部件时，微型金属还将包括由多孔金属基底形成的导电基底，该多孔金属基底嵌入柔性悬臂式微型显微镜。 还提供了制造柔性悬臂微型金刚石的方法以及使用柔性悬臂微型重复复制悬臂微型零件的方法。
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公开(公告)号：US07090189B2
公开(公告)日：2006-08-15
申请号：US10222763
申请日：2002-08-15
申请人： Alfredo Martin Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry Joseph Garino
发明人： Alfredo Martin Morales , Linda A. Domeier , Marcela G. Gonzales , Patrick N. Keifer , Terry Joseph Garino
IPC分类号： B22D25/04
CPC分类号： C25D1/10 , B29C33/0016 , B29C33/3857 , B29C33/52 , B29C2045/0094
摘要： A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
摘要翻译： 提供了符合标准的悬臂三维微镜。 柔性悬臂微型适用于复制悬臂微型零件，大大简化了这种悬臂零件的复制。 柔性悬臂微型金属可用于使用铸造或电铸技术制造微型材料。 当柔性微型金属用于制造电铸悬臂部件时，微型金属还将包括由多孔金属基底形成的导电基底，该多孔金属基底嵌入柔性悬臂式微型显微镜。 还提供了制造柔性悬臂微型金刚石的方法以及使用柔性悬臂微型重复复制悬臂微型零件的方法。
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公开(公告)号：US06679471B2
公开(公告)日：2004-01-20
申请号：US10052948
申请日：2002-01-17
IPC分类号： B22D2540
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
摘要翻译： 提供具有可电镀背衬的牺牲塑料模具，其方法是通过经由多孔金属基材（片材，筛网，网孔或泡沫）注入浇注液体制剂而制成这种模具的方法，并且进入微尺度主体的特征 模子。 在铸造和脱模时，将多孔金属基材嵌入浇注配方中并投射具有由模具确定的特征的塑料结构。 塑料结构提供了机械地结合到多孔金属基底上的牺牲塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑件。 在电镀和研磨之后，牺牲塑料可以溶解，留下所需的金属结构结合到多孔金属基底上。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。
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公开(公告)号：US07390377B1
公开(公告)日：2008-06-24
申请号：US11234607
申请日：2005-09-22
申请人： Thomas I. Wallow , Marion C. Hunter , Karen Lee Krafcik , Alfredo M. Morales , Blake A. Simmons , Linda A. Domeier
发明人： Thomas I. Wallow , Marion C. Hunter , Karen Lee Krafcik , Alfredo M. Morales , Blake A. Simmons , Linda A. Domeier
CPC分类号： C09J5/02 , B29C65/02 , B29C65/4815 , B29C65/482 , B29C65/4825 , B29C65/4835 , B29C65/4845 , B29C65/5042 , B29C65/523 , B29C66/1122 , B29C66/324 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/83221 , B29C66/954 , B29C66/9592 , B29L2031/756 , B81B2201/058 , B81C3/001 , C08J5/121 , C08J5/122 , C09J2400/226 , B29K2023/38
摘要： We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.
摘要翻译： 我们展示了一种将图案化热塑性部件接合到分层结构中的新方法。 该方法利用壳II透过物扩散在连接的表面上产生尺寸受控的激活的结合层。 它能够产生以粘结破坏为特征的粘结，同时保持粘合表面中的图案特征的保真度。 该方法独特地适用于微流体多层结构的生产，因为它允许塑料部件之间的结合形成界面以微米的长度尺度被精确地操纵。 粘结增强程序很容易集成到标准工艺流程中，不需要专门的设备。
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公开(公告)号：US06422528B1
公开(公告)日：2002-07-23
申请号：US09765078
申请日：2001-01-17
IPC分类号： B22D2504
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
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公开(公告)号：US06472459B2
公开(公告)日：2002-10-29
申请号：US09764615
申请日：2001-01-16
IPC分类号： C08K308
CPC分类号： B22F1/0018 , B22F3/1275 , B22F2003/1046 , B28B1/14 , B28B7/342 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B35/111 , C04B35/2658 , C04B35/622 , G03F7/00 , G03F7/0002 , Y10S977/777 , Y10S977/887 , Y10S977/888 , Y10S977/893
摘要： A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic microstructures so provided are then sintered.
摘要翻译： 提供了用于制造金属微结构的方法，即微米或亚微米尺寸的微组件。 制备含有任选的粘合剂和纳米尺寸（1至1000nm直径）金属颗粒的模制组合物。 模具，例如光刻图案的模具，优选LIGA或负型光致抗蚀剂模具，用模塑组合物填充并压缩。 然后将所得微结构从模具中取出，然后将如此提供的所得金属微结构烧结。
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公开(公告)号：US06929733B2
公开(公告)日：2005-08-16
申请号：US10134060
申请日：2002-04-24
CPC分类号： C25D1/10 , B29C33/3857 , B29C33/52 , B29C2045/0094 , Y10T29/49984 , Y10T29/49988
摘要： A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.
摘要翻译： 提供具有电镀背衬的牺牲塑料模具。 一个实施方案包括通过多孔金属基材（片，筛，网或泡沫）将软化或熔融的热塑性塑料注入到与多孔金属基底接触的微尺度模制工具的特征中。 在脱模时，多孔金属基材将嵌入热塑性塑料中，并且将塑造具有由模具确定的特征的塑料结构。 这种塑料结构反过来又提供了机械地结合到多孔金属基底上的牺牲性塑料模具，其提供适于电镀连续或不连续金属重复的导电支撑体。 在电镀和研磨之后，牺牲塑料可以溶解以留下结合到多孔金属基底的所需金属结构。 任选地，电镀结构可以通过多孔基材或其上的涂层的选择性溶解从多孔基材脱粘。
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公开(公告)号：US06458263B1
公开(公告)日：2002-10-01
申请号：US09677041
申请日：2000-09-29
IPC分类号： C25D502
CPC分类号： C25D1/003 , B81B2203/0118 , B81C1/00666 , B81C2201/019 , B81C2201/032 , C25D5/022 , G03F7/00 , G03F7/0035 , H01L21/76885
摘要： In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.
摘要翻译： 在形成多层LIGA微观结构时，通过将掩模曝光通过诸如X射线的辐射来形成预成型的光致抗蚀剂材料片，例如聚甲基丙烯酸甲酯（PMMA），并使用显影剂显影以除去曝光的光致抗蚀剂材料。 然后通过将金属电镀到已经从其去除光致抗蚀剂的区域中形成第一微结构。 通过用导电聚合物覆盖第一微结构，加工初始微结构，加工导电聚合物层以露出第一微结构的表面，用金属层密封导电聚合物和第一微结构的表面，并且 然后在第一级结构之上形成第二级结构。 以这种方式，可以建立多层微观结构以允许形成复杂的悬臂微结构。
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公开(公告)号：US5364700A
公开(公告)日：1994-11-15
申请号：US813839
申请日：1985-12-27
申请人： Linda A. Domeier
发明人： Linda A. Domeier
CPC分类号： C08J5/24 , C08F22/40 , C08G73/12 , C08L63/00 , C08J2379/08 , Y10S428/902 , Y10T428/2918 , Y10T428/2967 , Y10T428/30
摘要： Described herein are novel rubber modified bismaleimide resins and prepregable resin compositions comprising these bismaleimides and one or more liquid co-reactants and optionally, one or more other additives.
摘要翻译： 本文描述的是新型橡胶改性双马来酰亚胺树脂和包含这些双马来酰亚胺和一种或多种液体共反应物以及任选的一种或多种其它添加剂的预浸合树脂组合物。
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10.发明授权Curable poly(acrylate) molding compositions containing a thermoplastic polymer low profile additive 失效含有热塑性聚合物低调添加剂的可固化聚（丙烯酸酯）模塑组合物
公开(公告)号：US4487798A
公开(公告)日：1984-12-11
申请号：US498502
申请日：1983-05-26
申请人： Linda A. Domeier
发明人： Linda A. Domeier
IPC分类号： C08F222/10 , C08F291/00 , B29D3/02 , B32B9/00 , B32B9/04 , C08K3/04
CPC分类号： C08F291/00 , C08F222/1006 , Y10T442/2893 , Y10T442/2934
摘要： This invention is directed to curable molding compositions containing a mixture of a poly(acrylate), a polymerizable ethylenically unsaturated monomer which serves to crosslink the poly(acrylate) to a thermoset product, unsubstituted or substituted meta- and/or para-divinylbenzene and a thermoplastic polymer low profile additive. The curable molding compositions exhibit improved shrink control during the curing reaction. This invention is also directed to fiber reinforced thermoset resin articles which exhibit generally improved surface appearance quality and can be produced by a rapid injection molding process from the curable molding compositions.
摘要翻译： 本发明涉及含有聚（丙烯酸酯），用于将聚（丙烯酸酯）交联到热固性产物上的可聚合烯属不饱和单体，未取代或取代的间 - 和/或对 - 二乙烯基苯的混合物的可固化模塑组合物和 热塑性聚合物低调添加剂。 可固化模塑组合物在固化反应期间显示改进的收缩控制。 本发明还涉及一种纤维增强热固性树脂制品，其具有大体上改进的表面外观质量，并且可以通过可固化模塑组合物的快速注射成型方法制备。
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