公开(公告)号：US20180020554A1

公开(公告)日：2018-01-18

申请号：US15716963

申请日：2017-09-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: H05K3/34 ,  B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  B23K1/00 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US09801285B2

公开(公告)日：2017-10-24

申请号：US14386601

申请日：2013-03-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: B23K31/02 ,  H05K3/34 ,  B23K35/26 ,  B23K35/02 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US11842974B2

公开(公告)日：2023-12-12

申请号：US16612883

申请日：2018-05-11

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo Gulino ,  Bogdan Bankiewicz ,  Oscar Khaselev ,  Anna Lifton ,  Michael T. Marczi ,  Girard Sidone ,  Paul Salerno ,  Paul J. Koep

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  B23K101/42

CPC classification number: H01L24/29 ,  B23K35/262 ,  B23K35/302 ,  C22C13/00 ,  H01L24/83 ,  B23K2101/42 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29216 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/83815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.