公开(公告)号：US20180020554A1

公开(公告)日：2018-01-18

申请号：US15716963

申请日：2017-09-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: H05K3/34 ,  B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  B23K1/00 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US09801285B2

公开(公告)日：2017-10-24

申请号：US14386601

申请日：2013-03-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: B23K31/02 ,  H05K3/34 ,  B23K35/26 ,  B23K35/02 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US20170245404A1

公开(公告)日：2017-08-24

申请号：US15426320

申请日：2017-02-07

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Michael Thomas Marczi ,  Karen Alice Tellefsen

IPC: H05K9/00 ,  B23K1/20 ,  B23K1/00 ,  B23K1/008 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K9/0024 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K1/181 ,  H05K3/3431 ,  H05K3/3494 ,  H05K9/0081 ,  H05K2201/0715 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.