公开(公告)号：US12183748B2

公开(公告)日：2024-12-31

申请号：US18518526

申请日：2023-11-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11637166B2

公开(公告)日：2023-04-25

申请号：US16651551

申请日：2019-11-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Qi Yao ,  Ke Wang ,  Zhanfeng Cao ,  Zhiwei Liang ,  Muxin Di ,  Guangcai Yuan ,  Xue Jiang ,  Dongni Liu

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/00

Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.

公开(公告)号：US20230049038A1

公开(公告)日：2023-02-16

申请号：US17975894

申请日：2022-10-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.

公开(公告)号：US11581461B2

公开(公告)日：2023-02-14

申请号：US16917921

申请日：2020-07-01

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Yingwei Liu ,  Zhanfeng Cao ,  Ke Wang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/56

Abstract: A display substrate includes a drive substrate and a welding pad provided on the drive substrate and electrically connected with the drive substrate. The display substrate further includes an insulating construction layer provided on the welding pad. The insulating construction layer is provided with a groove for exposing the welding pad. A bonding material is accommodated in the groove, and a micro light emitting diode is electrically connected with the welding pad through the bonding material.

公开(公告)号：US11282974B2

公开(公告)日：2022-03-22

申请号：US16169365

申请日：2018-10-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Qingrong Ren ,  Jianming Sun ,  Yingwei Liu

IPC: H01L31/032 ,  H01L27/32 ,  H01L31/0336 ,  H01L31/0392 ,  H01L31/105 ,  H01L31/0296

Abstract: A photosensitive element includes a first film layer, a second film layer and a third film layer. The first film layer, the second film layer and the third film layer are in a sequentially stacked structure, the first film layer is a p-type copper indium gallium selenide (CIGS) layer, the second film layer is an i-type CIGS layer, and the third film layer is an n-type film layer, and the first film layer, the second film layer and the third film layer form a PIN junction structure.

公开(公告)号：US20210202530A1

公开(公告)日：2021-07-01

申请号：US16084452

申请日：2018-01-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qi Yao ,  Yingwei Liu

IPC: H01L27/12

Abstract: The present disclosure provides an array substrate, a manufacturing method thereof, a flexible display panel and a display device, for achieving frame-free full-screen flexible display product. The array substrate provided in the present disclosure comprises a flexible base substrate, a thin film transistor on a first surface of the flexible base substrate, and a wiring terminal for transmitting a signal to an electrode of the thin film transistor on a second surface of the flexible base substrate opposite to the first surface, wherein the electrode of the thin film transistor is electrically connected to the wiring terminal through a via hole penetrating the flexible base substrate.

公开(公告)号：US10430635B2

公开(公告)日：2019-10-01

申请号：US15767704

申请日：2017-09-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qingrong Ren ,  Wei Yang ,  Jianming Sun ,  Yingwei Liu ,  Liangjian Li ,  Haisheng Wang ,  Yingming Liu

IPC: G06K9/00

Abstract: A fingerprint identification sensor, a fingerprint identification method and an electronic device are disclosed. The fingerprint identification sensor includes a substrate; a fingerprint sensing element disposed on the substrate and including a thin film transistor, an off-state leakage current of the thin film transistor varying with the intensity of light irradiating onto an active area thereof; and a fingerprint identification light source arranged to emit light that irradiates onto a finger and is reflected thereby, the reflected light irradiating onto the active area of the thin film transistor. Thus, the fingerprint identification can be realized conveniently, and the fingerprint identification sensor has at least one of the advantages like high sensitivity and simple structure.

公开(公告)号：US10209558B2

公开(公告)日：2019-02-19

申请号：US15745062

申请日：2017-08-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Qi Yao ,  Zhanfeng Cao ,  Feng Zhang ,  Haixu Li ,  Shengguang Ban ,  Yingwei Liu

IPC: H01L51/52 ,  G02F1/1335 ,  H01L27/12 ,  G02F1/1362 ,  H01L21/02 ,  H01L21/3065 ,  H01L29/786 ,  G02F1/1368 ,  H01L21/3213 ,  H01L29/66

Abstract: An array substrate and a manufacturing method thereof, and a display device are provided. The array substrate includes: a base substrate, an active layer, and a first polarization structure. The active layer is disposed on the base substrate; the first polarization structure is disposed on a side of the active layer facing the base substrate, and an orthographic projection of the first polarization structure on the base substrate is at least partially overlapped with an orthographic projection of the active layer on the base substrate.

公开(公告)号：US20180277660A1

公开(公告)日：2018-09-27

申请号：US15793299

申请日：2017-10-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu

IPC: H01L29/66 ,  H01L29/786 ,  G06K9/00

Abstract: This disclosure discloses a production method of a thin-film transistor, a thin-film transistor, a display apparatus, and a fingerprint recognition unit. Said method comprises the steps of: sequentially depositing a metal layer and an indium zinc oxide layer as a protective layer on a substrate; etching the metal layer and the indium zinc oxide layer to form a first electrode and a second electrode of a photosensitive device; and forming a photoelectric semiconductor of the photosensitive device on the first electrode.

公开(公告)号：US12087892B2

公开(公告)日：2024-09-10

申请号：US17043937

申请日：2019-10-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Zhijun Lv ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05655 ,  H01L2224/0568 ,  H01L2224/1145 ,  H01L2224/11622 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13124 ,  H01L2224/16057 ,  H01L2224/1607 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81345 ,  H01L2224/81898

Abstract: The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.