公开(公告)号：US12284766B2

公开(公告)日：2025-04-22

申请号：US18003866

申请日：2021-06-28

Applicant: BYD COMPANY LIMITED

Inventor： Wei Zhou ,  Qiang Xu ,  Caicai Xie

IPC: H05K3/02 ,  C04B37/02 ,  C23C22/52 ,  H05K1/03 ,  H05K3/38

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

公开(公告)号：US09601676B2

公开(公告)日：2017-03-21

申请号：US14891146

申请日：2014-06-24

Applicant: BYD COMPANY LIMITED

Inventor： Xinping Lin ,  Qiang Xu

IPC: H01L33/64 ,  H01L33/36 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/641 ,  H01L33/36 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.

公开(公告)号：US09974171B2

公开(公告)日：2018-05-15

申请号：US14943747

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qiang Xu ,  Xinping Lin

IPC: H05K1/05 ,  H05K3/18 ,  C25D11/24 ,  H05K3/44 ,  C23C18/18 ,  C23C18/16 ,  C25D11/08 ,  C25D11/16 ,  C23C18/40 ,  C25D11/10

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.