Abstract:
Disclosed herein is a fiber optic-to-waveguide coupling assembly with an overlap for edge coupling. The fiber optic-to-waveguide coupling assembly includes a first coupler having a substrate and at least one data fiber, and an interposer with at least one waveguide. A first coupler overlap portion of the substrate is positionable proximate a first interposer overlap portion of the interposer to form a first overlap therebetween to align the at least one data fiber with the at least one waveguide. The substrate and the interposer may each include complementary alignment features to further align the at least one data fiber and the at least one waveguide. The fiber optic-to-waveguide coupling assembly provides simple and accurate alignment with simplified manufacture and assembly.
Abstract:
Opto-electrical connection systems including opto-electrical cables providing configurable connectivity between electrical devices having electrical interfaces are disclosed. Related assemblies and methods are also disclosed. By using configurable connection assemblies having at least one configurable connection device adapted to accept optical connectors of optical fibers of opto-electrical cables, many electrical devices having electrical interfaces may be configurably connected. For example, the configurable opto-electrical connection system may be configured to provide more bandwidth and/or connect electrical devices with less power consumption than would be associated with conventional copper cabling solutions. In this manner, the high bandwidth, lower power consumption, and long distance signal capability of optical fibers may be provided to connect electronic devices which were originally designed with electrical interfaces meant to be connected with copper cables.
Abstract:
Receptacle ferrules with at least one monolithic lens system and fiber optic connectors using same are disclosed. Ferrule assemblies formed by mating plug and receptacle ferrules are also disclosed, as are connector assemblies formed by mating plug and receptacle connectors. The fiber optic connectors and connector assemblies are suitable for use with commercial electronic devices and provide either an optical connection, or both electrical and optical connections. The monolithic optical system defines a receptacle optical pathway having a focus at the receptacle ferrule front end. When a plug ferrule having a plug optical pathway is mated with the receptacle ferrule, the plug and receptacle optical pathways are optically coupled at a solid-solid optical pathway interface where light passing therethrough is either divergent or convergent, and where unwanted liquid is substantially expelled.
Abstract:
The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.
Abstract:
Receptacle ferrules with at least one monolithic lens system and fiber optic connectors using same are disclosed. Ferrule assemblies formed by mating plug and receptacle ferrules are also disclosed, as are connector assemblies formed by mating plug and receptacle connectors. The fiber optic connectors and connector assemblies are suitable for use with commercial electronic devices and provide either an optical connection, or both electrical and optical connections. The monolithic optical system defines a receptacle optical pathway having a focus at the receptacle ferrule front end. When a plug ferrule having a plug optical pathway is mated with the receptacle ferrule, the plug and receptacle optical pathways are optically coupled at a solid-solid optical pathway interface where light passing therethrough is either divergent or convergent, and where unwanted liquid is substantially expelled.
Abstract:
The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL≤0.05 dB/cm and a birefringence magnitude |B|≤0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.
Abstract:
Small-form-factor fiber optic interface devices with an internal lens are disclosed. The fiber optic interface devices have a ferrule with a bore that supports an optical waveguide. The lens is on or adjacent the ferrule front end and is aligned with the bore. A first planar surface is provided on or adjacent the lens. The first planar surface interfaces with a second planar surface of a second fiber optic interface device to form a fiber optic interface assembly having a liquid-displacing interface when the first and second fiber optic interface devices are engaged.
Abstract:
The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL≤0.05 dB/cm and a birefringence magnitude |B|≤0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.
Abstract:
The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL≤0.05 dB/cm and a birefringence magnitude |B|≤0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.
Abstract:
The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.