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公开(公告)号:US12103885B2
公开(公告)日:2024-10-01
申请号:US17269558
申请日:2019-08-06
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
CPC classification number: C03B23/037 , C03C4/18 , C03C10/0018 , C03C15/00 , C03C21/002 , C03C2204/00
Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.
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公开(公告)号:US12005677B2
公开(公告)日:2024-06-11
申请号:US17270916
申请日:2019-08-13
Applicant: CORNING INCORPORATED
Inventor: Shinu Baby , Kuan-Ting Kuo , Yousef Kayed Qaroush , Robert Lee Smith, III
CPC classification number: B32B17/06 , B32B7/12 , B32B2307/558 , B32B2307/581 , B32B2307/584 , B32B2457/20 , B32B2571/00
Abstract: An article including a laminate having a substrate and an ultra-thin cover glass layer bonded to atop surface of the substrate. The ultra-thin cover glass layer has a thickness in the range of 1 micron to 49 microns. The ultra-thin cover glass layer is bonded to the top surface of the substrate with an optically transparent adhesive layer having a thickness in the range of 5 microns to 50 microns.
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公开(公告)号:US20220289623A1
公开(公告)日:2022-09-15
申请号:US17637648
申请日:2020-08-12
Applicant: CORNING INCORPORATED
Inventor: Diane Kimberlie Guilfoyle , Yuhui Jin , Kuan-Ting Kuo , Linda Frances Reynolds-Heffer
Abstract: A method of chemically strengthening a glass-based article via ion exchange, wherein the glass-based article has a thickness of less than about 300 mm. The glass-based article may be chemically strengthened by ion exchanged to achieve a depth of compression DOC ranging from about 5 mm to about 60 mm and a peak compressive stress in a range from about 300 MPa to about 2000 MPa. The high peak compressive stress provides the ability to withstand the stresses associated with bending and to resist damage caused by impact. Additionally, the glass-based article retains net compression to contain surface flaws when the glass is subjected to bending around a tight radius in use, for example, as cover glass in flexible and foldable displays.
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公开(公告)号:US20210178730A1
公开(公告)日:2021-06-17
申请号:US17270916
申请日:2019-08-13
Applicant: CORNING INCORPORATED
Inventor: Shinu Baby , Kuan-Ting Kuo , Yousef Kayed Qaroush , Robert Lee Smith
Abstract: An article including a laminate having a substrate and an ultra-thin cover glass layer bonded to atop surface of the substrate. The ultra-thin cover glass layer has a thickness in the range of 1 micron to 49 microns. The ultra-thin cover glass layer is bonded to the top surface of the substrate with an optically transparent adhesive layer having a thickness in the range of 5 microns to 50 microns.
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5.
公开(公告)号:US20180108868A1
公开(公告)日:2018-04-19
申请号:US15784676
申请日:2017-10-16
Applicant: Corning Incorporated
Inventor: Kuan-Ting Kuo , Jen-Chieh Lin , Lu Zhang
CPC classification number: H01L51/5262 , B05D3/067 , H01L51/0097 , H01L51/5268 , H01L51/56 , H01L2251/303 , H01L2251/5338 , H01L2251/5369 , Y02E10/549
Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.
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公开(公告)号:US20210291494A1
公开(公告)日:2021-09-23
申请号:US17260333
申请日:2019-07-09
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
IPC: B32B17/10 , B32B7/12 , B32B27/36 , C03B23/037 , B32B37/12
Abstract: A cover element for an electronic device that includes a redrawn glass element, first and second primary surfaces, and a polymeric layer disposed over the first primary surface. The redrawn glass element has a reduced thickness and an average surface roughness of 1 nanometer or less. Further, the cover element can withstand a pen drop height of greater than 6 centimeters or 2.5 times or more than that of a control pen drop height of the cover element having a non-redrawn glass element the layer according to Drop Test 1.
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7.
公开(公告)号:US11709291B2
公开(公告)日:2023-07-25
申请号:US16965218
申请日:2019-01-25
Applicant: CORNING INCORPORATED
Inventor: Jun Hou , Kuan-Ting Kuo , Kevin Robert McCarthy , Robert Lee Smith, III
IPC: B32B7/14 , G02B1/111 , G02B1/14 , B32B5/02 , B32B17/04 , B32B27/28 , H10K50/84 , G02B1/115 , H04M1/02
CPC classification number: G02B1/111 , B32B5/024 , B32B7/14 , B32B17/04 , B32B27/281 , G02B1/14 , H10K50/84 , B32B2262/101 , B32B2307/536 , B32B2307/584 , B32B2457/206 , G02B1/115 , H04M1/0268
Abstract: Optically transparent fiber glass cover substrates for electronic displays. The cover substrates include an optically transparent fiberglass composite layer including a fiberglass layer embedded in a matrix material and an optically transparent hard-coat layer bonded to a top surface of the optically transparent fiberglass composite layer. A bottom surface of the optically transparent fiberglass composite layer may define a bottommost exterior surface of a cover substrate. The bottommost exterior surface of a cover substrate may be disposed over a display surface of an electronic display to protect the display surface from damage.
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公开(公告)号:US20210331961A1
公开(公告)日:2021-10-28
申请号:US17269558
申请日:2019-08-06
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.
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公开(公告)号:US12030276B2
公开(公告)日:2024-07-09
申请号:US16970144
申请日:2019-02-06
Applicant: CORNING INCORPORATED
Inventor: Kuan-Ting Kuo , Robert Lee Smith, III
IPC: B32B17/10 , B32B7/12 , C09D175/04 , C09D183/04
CPC classification number: B32B17/10 , B32B7/12 , B32B17/10018 , B32B17/10091 , B32B17/10137 , B32B17/10165 , B32B17/10174 , C09D175/04 , C09D183/04 , B32B2250/02 , B32B2307/412 , B32B2307/536 , B32B2307/558 , B32B2307/732 , B32B2457/20 , Y10T428/31598 , Y10T428/31663
Abstract: A glass article including an ultra-thin glass layer and an optically transparent polymeric hard-coat layer having a pencil hardness of 8H or more bonded to the ultra-thin glass layer. The optically transparent polymer hard-coat layer may include an organic polymer material or an aliphatic or aromatic hexafunctional urethane acrylate. In some embodiments, the glass article may have an impact resistance defined by the capability of the glass article to avoid failure at a pen drop height that is 2 times or more than that of a control pen drop height of the ultra-thin glass layer without the optically transparent polymeric hard-coat layer, where the pen drop height and the control pen drop height are measured according to the Pen Drop Test. In some embodiments, the glass article may survive a bend radius of 5 mm or less.
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公开(公告)号:US20240208198A1
公开(公告)日:2024-06-27
申请号:US18389252
申请日:2023-11-14
Applicant: CORNING INCORPORATED
Inventor: Julia Anne Dorothee Brueckner , Ya-Huei Chang , Kuan-Ting Kuo , Prantik Mazumder , Jian-Zhi Jay Zhang
CPC classification number: B32B43/006 , B32B7/12 , B32B17/06 , H01L21/6835
Abstract: Articles and methods for temporary bonding of substrates are described. The articles include a photo-release layer to enable reversal of the temporary bonding upon exposure of the photo-release layer to light to separate the substrates. The method includes plasma treatment of the photo-release layer to increase the bonding energy. Higher bonding energy allows for processing of the article with greater mechanical force before separation. Plasma treatment also allows for temporary bonding with a thinner photo-release layer and a photo-release layer with low total thickness variation (TTV). Once separated from the article, a processed substrate can be bonded to other substrates.
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