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公开(公告)号：US10735101B2
公开(公告)日：2020-08-04
申请号：US15664981
申请日：2017-07-31
Applicant: Cisco Technology, Inc.
Inventor： Stefan Pfnuer , Ravi Kachru , John Fangman , Utpal Chakrabarti
IPC: H04B10/50 , G02B6/42 , H01L33/64 , H01L33/52 , H05K13/00 , H01S5/022 , H01S5/024 , H01S5/02 , H01S5/026 , H01L25/16
Abstract: A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.
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公开(公告)号：US10175448B2
公开(公告)日：2019-01-08
申请号：US14331315
申请日：2014-07-15
Applicant: Cisco Technology, Inc.
Inventor： Mary Nadeau , Vipulkumar Patel , Prakash Gothoskar , John Fangman , John Matthew Fangman , Mark Webster
Abstract: An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.
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Patent Agency Ranking
公开(公告)号：US09755752B2
公开(公告)日：2017-09-05
申请号：US14153494
申请日：2014-01-13
Applicant: Cisco Technology, Inc.
Inventor： Stefan Pfnuer , Ravi Kachru , John Fangman , Utpal Chakrabarti
IPC: H04B10/50 , G02B6/42 , H05K13/00 , H01L33/64 , H01L33/52 , H01S5/022 , H01S5/024 , H01S5/02 , H01S5/026
CPC classification number: H04B10/503 , G02B6/4208 , G02B6/4236 , G02B6/4249 , G02B6/4251 , G02B6/4271 , H01L33/52 , H01L33/64 , H01S5/02 , H01S5/02236 , H01S5/02288 , H01S5/02415 , H01S5/0265 , H05K13/00 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49778 , Y10T29/49815 , Y10T29/49826 , Y10T29/53174 , Y10T29/53178
Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.
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公开(公告)号：US09261652B2
公开(公告)日：2016-02-16
申请号：US13742483
申请日：2013-01-16
Applicant: Cisco Technology, Inc.
Inventor： John Fangman , Vipulkumar Patel , Ravinder Kachru
CPC classification number: G02B6/36 , B32B37/1292 , G02B6/32 , G02B6/4204 , G02B6/4214 , G02B6/4239 , G02B6/4244 , G02B6/4246
Abstract: An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.
Abstract translation: 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料（例如焊料或环氧树脂）附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽，多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。
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公开(公告)号：US09213152B2
公开(公告)日：2015-12-15
申请号：US13737029
申请日：2013-01-09
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , John Fangman , Vipulkumar Patel , Kishor Desai , Ravinder Kachru
CPC classification number: G02B6/42 , G02B6/12 , G02B6/3886 , G02B6/4214 , G02B6/4259 , G02B6/4292 , Y10T29/49155
Abstract: An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.
Abstract translation: 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。
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公开(公告)号：US20170331557A1
公开(公告)日：2017-11-16
申请号：US15664981
申请日：2017-07-31
Applicant: Cisco Technology, Inc.
Inventor： Stefan Pfnuer , Ravi Kachru , John Fangman , Utpal Chakrabarti
IPC: H04B10/50 , G02B6/42 , H01L33/52 , H05K13/00 , H01L33/64 , H01S5/026 , H01S5/02 , H01S5/022 , H01S5/024
Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.
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公开(公告)号：US20150121683A1
公开(公告)日：2015-05-07
申请号：US14153494
申请日：2014-01-13
Applicant: Cisco Technology, Inc.
Inventor： Stefan Pfnuer , Ravi Kachru , John Fangman , Utpal Chakrabarti
IPC: H05K13/00
CPC classification number: H04B10/503 , G02B6/4208 , G02B6/4236 , G02B6/4249 , G02B6/4251 , G02B6/4271 , H01L33/52 , H01L33/64 , H01S5/02 , H01S5/02236 , H01S5/02288 , H01S5/02415 , H01S5/0265 , H05K13/00 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49778 , Y10T29/49815 , Y10T29/49826 , Y10T29/53174 , Y10T29/53178
Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.
Abstract translation: 在一个实施例中，公开了一种制造光通信设备的方法。 光学子组件和光学平台可以形成光通信设备。 预定义的断裂线被放置在载体晶片上。 晶片可以容纳调制器子座和激光子座。 使用加工工艺将调制器子座安装在光学平台上，激光子座与热电冷却器相邻。 激光子座可以密封并对准以与调制器子座连通。
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