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    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips
    2.
    发明授权
    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips 有权

    公开(公告)号：US11378751B2

    公开(公告)日：2022-07-05

    申请号：US16923852

    申请日：2020-07-08

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

    IPC: G02B6/30 ,  G02B6/26 ,  G02B6/42

    Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

    Unequal spacing on multilevel signals
    3.
    发明授权
    Unequal spacing on multilevel signals 有权

    公开(公告)号：US11101890B2

    公开(公告)日：2021-08-24

    申请号：US16933837

    申请日：2020-07-20

    Applicant: Cisco Technology, Inc.

    Inventor： Marco Mazzini ,  Christopher R. S. Fludger ,  Alberto Cervasio ,  Matthew J. Traverso

    IPC: H04B10/2507 ,  H04B10/524 ,  H04L25/49 ,  H04J14/02 ,  H04B1/04 ,  H04B10/2513 ,  H04B10/516 ,  H04B10/54 ,  H04B10/079

    Abstract: The present disclosure provides signal management with unequal eye spacing by: determining a dispersion slope of a channel between a transmitter and a receiver based on a temperature of the transmitter and a wavelength used by the transmitter to transmit signals over the channel; determining maximum and minimum powers for transmission over the channel; assigning a plurality of rails to a corresponding plurality of power levels, wherein amplitude differences between adjacent rails of the plurality of rails are based on the dispersion slope and produce a first eye pattern with a first Ratio of Level Mismatch (RLM) less than one; encoding, by the transmitter, data onto a conditioned signal according to the plurality of rails; and transmitting the conditioned signal over the channel, so that the conditioned signal demonstrates a second eye pattern with a second RLM greater than the first RLM when received at the receiver.

    Wafer level optical probing structures for silicon photonics
    4.
    发明授权
    Wafer level optical probing structures for silicon photonics 有权

    公开(公告)号：US10145758B2

    公开(公告)日：2018-12-04

    申请号：US15582306

    申请日：2017-04-28

    Applicant: Cisco Technology, Inc.

    Inventor： Matthew J. Traverso ,  Ravi S. Tummidi ,  Mark A. Webster ,  Sandeep Razdan

    IPC: G01N21/00 ,  G01M11/00 ,  G02B6/12 ,  G02B6/13 ,  G02B6/122

    Abstract: Embodiments herein describe techniques for testing optical components in a photonic chip using a testing structure disposed in a sacrificial region of a wafer. In one embodiment, the wafer is processed to form multiple photonic chips integrated into the wafer. While forming optical components in the photonic chips (e.g., modulators, detectors, waveguides, etc.), a testing structure can be formed in one or more sacrificial regions in the wafer. In one embodiment, the testing structure is arranged near an edge coupler in the photonic chip such that an optical signal can be transferred between the photonic chip and the testing structure. Moreover, the testing structure has a grating coupler disposed at or near a top surface of the wafer which permits optical signals to be transmitted into, or received from, the grating coupler when an optical probe is arranged above the grating coupler.

    Passive fiber to chip coupling using post-assembly laser patterned waveguides
    9.
    发明授权
    Passive fiber to chip coupling using post-assembly laser patterned waveguides 有权

    公开(公告)号：US10962719B2

    公开(公告)日：2021-03-30

    申请号：US16260622

    申请日：2019-01-29

    Applicant: Cisco Technology, Inc.

    Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Jock T. Bovington ,  Matthew J. Traverso

    IPC: G02B6/30

    Abstract: Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.

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