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    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS
    1.
    发明申请
    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS 有权
    收货机的平均包装平台

    公开(公告)号：US20140248723A1

    公开(公告)日：2014-09-04

    申请号：US14276566

    申请日：2014-05-13

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Vipulkumar PATEL ,  Mark WEBSTER ,  Prakash GOTHOSKAR ,  Ravinder KACHRU ,  Soham PATHAK ,  Rao V. YELAMARTY ,  Thomas DAUGHERTY ,  Bipin DAMA ,  Kaushik PATEL ,  Kishor DESAI

    IPC: H01L25/00 ,  H01L25/16

    CPC classification number: H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

    Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

    INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPERATURE-SENSITIVE OPTO-ELECTRONIC COMPONENTS
    3.
    发明申请
    INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPERATURE-SENSITIVE OPTO-ELECTRONIC COMPONENTS 有权
    具有温度敏感光电元件的热隔离区域的间隔器配置

    公开(公告)号：US20150023377A1

    公开(公告)日：2015-01-22

    申请号：US14510654

    申请日：2014-10-09

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Vipulkumar PATEL ,  Bipin DAMA ,  Kishor DESAI

    IPC: H01S5/024 ,  H01S5/022 ,  H01S5/40 ,  H01S5/00

    CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

    Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

    Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。

    SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY
    5.
    发明申请
    SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY 有权
    自耦连接光纤阵列总成

    公开(公告)号：US20150016784A1

    公开(公告)日：2015-01-15

    申请号：US14498669

    申请日：2014-09-26

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Utpal CHAKRABARTI ,  Vipulkumar PATEL ,  Bipin DAMA ,  Ravinder KACHRU ,  Kishor DESAI

    IPC: G02B6/42

    CPC classification number: G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

    Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

    Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

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