公开(公告)号：US20230312777A1

公开(公告)日：2023-10-05

申请号：US18330632

申请日：2023-06-07

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kenji ISHII ,  Yoshito TANAKA ,  Takumi SHIMOSUKI ,  Masaji KOMORI ,  Hirofumi MUKAE ,  Toshiyuki FUKUSHIMA ,  Akiyoshi YAMAUCHI ,  Yosuke KISHIKAWA ,  Hirokazu AOYAMA

IPC: C08F14/26

CPC classification number: C08F14/26

Abstract: A seal for a livestock sensor containing a resin, or a rubber free from a chlorine atom. The seal is at least one selected from a packing, an O-ring, and a gasket, and the seal is configured to prevent a body fluid containing an organic acid in livestock from entering a space that contains a detecting portion or a substrate of the livestock sensor. Also disclosed is a livestock sensor including the seal.

公开(公告)号：US20160005506A1

公开(公告)日：2016-01-07

申请号：US14759089

申请日：2014-01-15

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Tadaharu ISAKA ,  Kenji ISHII ,  Takeshi SHIMONO

IPC: H01B3/44 ,  B29C47/00 ,  C08J9/00 ,  C08K3/38 ,  C08K5/42

CPC classification number: H01B3/445 ,  B29C47/0004 ,  B29C47/0026 ,  B29C47/0042 ,  B29C47/025 ,  B29C47/402 ,  B29C47/92 ,  B29C2947/926 ,  B29C2947/92704 ,  B29C2947/92876 ,  B29K2027/12 ,  B29K2105/04 ,  B29L2023/001 ,  B29L2031/3462 ,  C08J9/0033 ,  C08J9/0066 ,  C08J9/122 ,  C08J2201/03 ,  C08J2203/06 ,  C08J2205/044 ,  C08J2207/06 ,  C08J2327/12 ,  C08J2327/18 ,  C08J2327/20 ,  C08K3/38 ,  C08K5/42 ,  C08K2003/385 ,  C09D127/18 ,  C08K13/02

Abstract: The present invention aims to provide a composition which can provide molded foams and foamed electric wires having a small average cell size and a high expansion ratio. The composition of the present invention includes a fluororesin; and boron nitride having an average particle size of 10.5 μm or greater, or boron nitride having a particle size distribution represented by (D84−D16)/D50 of 1.2 or lower.

Abstract translation: 本发明的目的在于提供一种组合物，其可以提供具有小平均泡孔尺寸和高膨胀率的模制泡沫和泡沫电线。 本发明的组合物包括氟树脂; 平均粒径为10.5μm以上的氮化硼或由（D84-D16）/ D50表示的粒度分布为1.2以下的氮化硼。

公开(公告)号：US20150353700A1

公开(公告)日：2015-12-10

申请号：US14761138

申请日：2014-01-15

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Tadaharu ISAKA ,  Kenji ISHII ,  Takeshi SHIMONO

IPC: C08J9/00 ,  B05D5/00 ,  B05D7/20 ,  H01B3/44

CPC classification number: C08J9/0033 ,  B05D5/00 ,  B05D7/20 ,  B29C48/0012 ,  B29C48/022 ,  B29C48/154 ,  B29C48/402 ,  B29C48/92 ,  B29C2948/926 ,  B29C2948/92704 ,  B29C2948/92876 ,  C08J9/0023 ,  C08J9/122 ,  C08J2201/03 ,  C08J2203/06 ,  C08J2205/044 ,  C08J2207/06 ,  C08J2327/12 ,  C08J2327/20 ,  C09D127/18 ,  H01B3/445 ,  Y10T428/294 ,  C08K5/42 ,  C08K13/02 ,  C08L27/18

Abstract: A composition which can provide foamed moldings and foamed electric wires having a small average cell size and a high foam content and causing fewer sparks. The composition includes a fluororesin (A) and a compound (B) which is a sulfonic acid or a salt thereof. The sulfonic acid is represented by the following formula (1): F(CF2)nSO3H (1) wherein n is 4 or 5, or the following formula (2): F(CF2)nCH2CH2SO3H (2) wherein n is 4 or 5. Also disclosed is a foamed molding formed from the composition and a method for producing a foamed molding.

Abstract translation: 可以提供具有小平均泡孔尺寸和高泡沫含量并且引起较少火花的泡沫模制品和泡沫电线的组合物。 该组合物包括氟树脂（A）和作为磺酸或其盐的化合物（B）。 磺酸由下式（1）表示：F（CF 2）n SO 3 H（1）其中n为4或5，或下式（2）：F（CF 2）n CH 2 CH 2 SO 3 H（2）其中n为4或5 还公开了由该组合物形成的发泡模制品和一种用于生产发泡模制品的方法。

公开(公告)号：US20250034386A1

公开(公告)日：2025-01-30

申请号：US18897316

申请日：2024-09-26

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirofumi MUKAE ,  Ayane NAKAUE ,  Yosuke KISHIKAWA ,  Taku YAMANAKA ,  Taketo KATO ,  Kenji ISHII

IPC: C08L27/18 ,  C08K3/04 ,  C08K3/08 ,  C08K3/38 ,  C08K7/14 ,  C08L27/22 ,  C09K5/14

Abstract: The disclosure aims to provide a fluororesin composition having excellent tensile properties and excellent handleability while containing a fluororesin having a history of being heated to a temperature equal to or higher than the melting point thereof and a molded article obtainable from the fluororesin composition. The disclosure relates to a non-melt-flowable fluororesin composition containing: a non-melt-flowable fluororesin A having a history of being heated to a temperature equal to or higher than a melting point thereof; a fluororesin B including at least one selected from the group consisting of a melt-flowable fluororesin and a non-melt-flowable fluororesin having no history of being heated to a temperature equal to or higher than a melting point thereof; and a filler.

公开(公告)号：US20230183450A1

公开(公告)日：2023-06-15

申请号：US18163498

申请日：2023-02-02

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hideki KOUNO ,  Kenji ISHII ,  Masato TOKUDA ,  Takahiro KITAHARA

IPC: C08K5/521 ,  C08L81/04 ,  C08L61/18 ,  C08J9/12 ,  C09D181/04 ,  C09D161/18 ,  B32B15/04 ,  B32B5/18 ,  H01B7/02 ,  H01B3/30 ,  H01B13/06

CPC classification number: C08K5/521 ,  C08L81/04 ,  C08L61/18 ,  C08J9/122 ,  C09D181/04 ,  C09D161/18 ,  B32B15/046 ,  B32B5/18 ,  H01B7/02 ,  H01B3/307 ,  H01B13/06 ,  C08J2381/04 ,  C08J2361/18 ,  C08J2481/04 ,  C08J2461/18 ,  B32B15/20

Abstract: A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.

公开(公告)号：US20230167258A1

公开(公告)日：2023-06-01

申请号：US18158748

申请日：2023-01-24

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kenji ISHII ,  Masato TOKUDA

IPC: C08J9/06 ,  H01B3/44 ,  H01B7/02 ,  H01B13/06

CPC classification number: C08J9/06 ,  H01B3/44 ,  H01B7/02 ,  H01B13/06 ,  C08J2327/18 ,  C08J2327/24 ,  C08J2203/00 ,  C08J2207/06

Abstract: A foam molding composition containing a fluororesin (A) and a compound (B) having a pyrolysis temperature of 300° C. or higher and a solubility parameter (SP value) of 8 to 15. Also disclosed is a foamed electric wire including a core wire, and a fluororesin layer or a fluororesin composition layer covering the core wire, a foam molded body, a method for producing a foam molded body, and a method for producing an electric wire.