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    CERAMIC CIRCUIT BOARD
    1.
    发明申请
    CERAMIC CIRCUIT BOARD 审中-公开

    公开(公告)号：US20200375029A1

    公开(公告)日：2020-11-26

    申请号：US16636239

    申请日：2018-07-30

    Applicant: DENKA COMPANY LIMITED

    Inventor： Atsushi SAKAI ,  Hideki HIROTSURU ,  Kohki ICHIKAWA ,  Yoshitaka TANIGUCHI

    IPC: H05K1/03 ,  H05K1/05

    Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

    BORON NITRIDE POWDER, METHOD FOR PRODUCING SAME, AND HEAT-DISSIPATING MEMBER PRODUCED USING SAME
    2.
    发明申请
    BORON NITRIDE POWDER, METHOD FOR PRODUCING SAME, AND HEAT-DISSIPATING MEMBER PRODUCED USING SAME 审中-公开

    公开(公告)号：US20200247672A1

    公开(公告)日：2020-08-06

    申请号：US16755715

    申请日：2018-08-17

    Applicant: DENKA COMPANY LIMITED

    Inventor： Go TAKEDA ,  Michiharu NAKASHIMA ,  Yoshitaka TANIGUCHI

    IPC: C01B21/064

    Abstract: To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C): (A) a particle strength of the bulky particles at a cumulative breakdown rate of 63.2% is 5.0 MPa or more; (B) an average particle size of the boron nitride powder is 2 μm or more and 20 μm or less; and (C) an orientation index of the boron nitride powder as determined from X-ray diffraction is 20 or less.

    HEAT DISSIPATION SHEET
    3.
    发明公开
    HEAT DISSIPATION SHEET 审中-公开

    公开(公告)号：US20230220262A1

    公开(公告)日：2023-07-13

    申请号：US18008598

    申请日：2021-06-11

    Applicant: DENKA COMPANY LIMITED

    Inventor： Kosuke WADA ,  Kiyotaka FUJI ,  Yoshitaka TANIGUCHI

    IPC: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/20

    CPC classification number: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/2039 ,  C08K2201/005 ,  C08K2201/001 ,  C08K2003/385 ,  C08J2383/07

    Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 μm or more; the particle size at the second maximum point is ⅔ or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 μm and a thickness of 0.2 mm or less.

    HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET
    5.
    发明申请
    HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET 有权

    公开(公告)号：US20230052370A1

    公开(公告)日：2023-02-16

    申请号：US17792835

    申请日：2021-03-18

    Applicant: DENKA COMPANY LIMITED

    Inventor： Kosuke WADA ,  Yoshitaka TANIGUCHI

    IPC: C09K5/14 ,  C08K3/38 ,  C08J3/20 ,  C08J5/18

    Abstract: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

    POWER MODULE
    6.
    发明申请
    POWER MODULE 审中-公开

    公开(公告)号：US20200373251A1

    公开(公告)日：2020-11-26

    申请号：US16636184

    申请日：2018-07-30

    Applicant: DENKA COMPANY LIMITED

    Inventor： Hideki HIROTSURU ,  Yoshitaka TANIGUCHI ,  Kohki ICHIKAWA ,  Atsushi SAKAI

    IPC: H01L23/00 ,  H01L23/15 ,  H01L25/07

    Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient α1 (×10−6/K) of the base plate and a linear thermal expansion coefficient α2 (×10−6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).  α   1 - α   2  ( α   1 + α   2 )  /  2 × 100 ≤ 10 ( 1 )

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