ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

    公开(公告)号:US20230408920A1

    公开(公告)日:2023-12-21

    申请号:US18458609

    申请日:2023-08-30

    CPC classification number: G03F7/039

    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition in which LWR of a pattern to be obtained is excellent; a resist film; a pattern forming method; and a method for manufacturing an electronic device.
    The actinic ray-sensitive or radiation-sensitive resin composition contains a resin having a group which is decomposed by action of acid to generate a polar group, in which the resin includes a repeating unit represented by General Formula (A2), and at least one of a requirement 1 or a requirement 2 is satisfied.



    Requirement 1: the actinic ray-sensitive or radiation-sensitive resin composition contains a salt represented by General Formula (1)
    Requirement 2: the resin has a residue formed by removing one hydrogen atom from the salt represented by General Formula (1)

    ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES

    公开(公告)号:US20230393473A1

    公开(公告)日:2023-12-07

    申请号:US18449475

    申请日:2023-08-14

    CPC classification number: G03F7/039

    Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition having excellent sensitivity to exposure. Another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, which relate to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition contains a resin which is decomposed by action of acid to increase polarity, in which at least one of a requirement that the actinic ray-sensitive or radiation-sensitive resin composition further contains a compound represented by Formula (1), or a requirement that the resin which is decomposed by action of acid to increase polarity has a residue formed by removing one hydrogen atom from the compound represented by Formula (1) is satisfied.

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