公开(公告)号：US20150108924A1

公开(公告)日：2015-04-23

申请号：US14586550

申请日：2014-12-30

Applicant: General Electric Company

Inventor： Ramanujam Ramabhadran ,  John Stanley Glaser

IPC: H01L41/04 ,  H01L41/25

CPC classification number: H01L41/042 ,  H01L41/25 ,  H02M7/53803 ,  H02M7/797 ,  H02M2001/0019 ,  Y10T29/42

Abstract: A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter.

Abstract translation: 用于驱动压电负载的系统包括直流（DC）电压源和双向DC-DC转换器，其具有耦合到DC电压源的初级侧和次级侧，并且包括被配置为接收 第一控制信号被配置为控制双向DC-DC转换器的初级侧的第一电压的转换为双向DC-DC转换器的次级侧上的第二电压。 驱动器系统还包括耦合到双向DC-DC转换器的次级侧的电容器，其被配置为去除第二电压的DC偏移，并且包括具有耦合到电容器的第一端子的无功负载和第二 端子耦合到双向DC-DC转换器的次级侧。

公开(公告)号：US20150108899A1

公开(公告)日：2015-04-23

申请号：US14060168

申请日：2013-10-22

Applicant: General Electric Company

Inventor： Ramanujam Ramabhadran ,  Charles Erklin Seeley ,  John Stanley Glaser ,  Robert James Thomas ,  Stanton Earl Weaver, Jr.

IPC: B05B17/06 ,  H05K7/20 ,  H02H9/04 ,  H05B33/08

CPC classification number: H02H9/04 ,  F21V29/63 ,  F21Y2115/10 ,  H02H9/041

Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.

Abstract translation: 冷却系统包括具有第一合成射流引线和第二合成射流引线的合成射流。 冷却系统还包括具有第一电容器引线和第二电容器引线的电容器。 第一电容器引线耦合到第一合成射流引线。 合成射流被配置为通过耦合到第二电容器引线和第二合成射流引线的交流（AC）电源来供电。

公开(公告)号：US20140124501A1

公开(公告)日：2014-05-08

申请号：US13670572

申请日：2012-11-07

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Timothy Scott Shaffer ,  John Stanley Glaser

IPC: H05B6/12

CPC classification number: H05B6/1254 ,  Y02B40/126

Abstract: An induction cooktop appliance is provided. The induction cooktop appliance includes an induction heating element and a metal top panel positioned above the induction heating element for supporting cooking utensils thereon. The metal top panel defines an opening above the induction heating element. The opening can limit or regulate eddy currents within the metal top panel.

Abstract translation: 提供感应炉灶具。 感应灶具装置包括感应加热元件和位于感应加热元件上方的用于在其上支撑炊具的金属顶板。 金属顶板限定了感应加热元件上方的开口。 开口可以限制或调节金属顶板内的涡流。

公开(公告)号：US20160165684A1

公开(公告)日：2016-06-09

申请号：US14561942

申请日：2014-12-05

Applicant: General Electric Company

Inventor： Ramanujam Ramabhadran ,  John Stanley Glaser

IPC: H05B33/08

CPC classification number: H05B33/0815 ,  H02M1/4241 ,  H02M1/4258 ,  H02M2001/0058 ,  Y02B70/126 ,  Y02B70/1491

Abstract: An illumination device is provided. The illumination device includes a light emitting source, and a clamped series resonant converter operatively coupled to the light emitting source, where the clamped series resonant converter is configured to automatically regulate a load current generated by the clamped series resonant converter in response to a load voltage applied by the light emitting source.

Abstract translation: 提供照明装置。 照明装置包括发光源和可操作地耦合到发光源的夹紧串联谐振转换器，其中钳位的串联谐振转换器被配置为响应于负载电压自动调节由钳位的串联谐振转换器产生的负载电流 由发光源施加。

公开(公告)号：US20140167248A1

公开(公告)日：2014-06-19

申请号：US13720351

申请日：2012-12-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Eladio Clemente Delgado ,  John Stanley Glaser ,  Brian Lynn Rowden

IPC: H01L23/46 ,  H01L25/00

CPC classification number: H01L23/473 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/46 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83815 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/00

Abstract: An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

Abstract translation: 集成功率模块包括具有至少一个切出区域的基本上平面的绝缘金属基板; 设置在所述切出区域内的至少一个基本上平面的陶瓷基板，其中所述陶瓷基板通过所述绝缘金属基板在至少两侧框架，所述陶瓷基板包括在第一侧上的第一金属层和在第一侧上的第二金属层 第二面 耦合到陶瓷衬底的第一侧的至少一个功率半导体器件; 耦合到所述绝缘金属基板的第一表面的至少一个控制装置; 功率覆盖层，电连接所述至少一个半导体功率器件和所述至少一个控制器件; 以及可操作地连接到所述至少一个陶瓷基板的第二金属层的冷却流体储存器，其中在所述冷却流体储存器中设置多个冷却流体通道。

公开(公告)号：US09722595B2

公开(公告)日：2017-08-01

申请号：US14983251

申请日：2015-12-29

Applicant: General Electric Company

Inventor： Fengfeng Tao ,  Michael Joseph Schutten ,  Jeffrey Joseph Nasadoski ,  Maja Harfman-Todorovic ,  John Stanley Glaser

IPC: H03K17/687 ,  H03K17/16 ,  H05K3/36 ,  H03K17/691

CPC classification number: H03K17/162 ,  H03K17/687 ,  H03K17/691 ,  H05K3/36

Abstract: A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.

公开(公告)号：US09331477B2

公开(公告)日：2016-05-03

申请号：US14060168

申请日：2013-10-22

Applicant: General Electric Company

Inventor： Ramanujam Ramabhadran ,  Charles Erklin Seeley ,  John Stanley Glaser ,  Robert James Thomas ,  Stanton Earl Weaver, Jr.

IPC: F21V29/02 ,  H01L23/467 ,  H02H9/04 ,  F21Y101/02 ,  F21V29/63

CPC classification number: H02H9/04 ,  F21V29/63 ,  F21Y2115/10 ,  H02H9/041

Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.

Abstract translation: 冷却系统包括具有第一合成射流引线和第二合成射流引线的合成射流。 冷却系统还包括具有第一电容器引线和第二电容器引线的电容器。 第一电容器引线耦合到第一合成射流引线。 合成射流被配置为通过耦合到第二电容器引线和第二合成射流引线的交流（AC）电源来供电。

公开(公告)号：US20150022056A1

公开(公告)日：2015-01-22

申请号：US14506761

申请日：2014-10-06

Applicant: General Electric Company

Inventor： John Stanley Glaser ,  Ramanujam Ramabhadran

IPC: H02M3/335 ,  H01L41/107

CPC classification number: H02M3/33584 ,  H01L41/042 ,  H01L41/107 ,  H02M2001/0077 ,  H02N2/0075 ,  Y10T29/42 ,  Y10T307/549

Abstract: A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal.

Abstract translation: 驱动器系统包括直流（DC）电压源和第一双向DC-DC转换器，其具有耦合到DC电压源的初级侧和次级侧，并且被配置为将初级侧的第一电压转换为 二次电压为第二电压。 驱动器系统还包括第二双向DC-DC转换器，其具有耦合到DC电压源的初级侧和耦合到第一双向DC-DC转换器的次级侧的次级侧，并且被配置为 将初级侧的第一电压转换为次级的第三电压。 第一和第二双向DC-DC转换器能够提升第一电压，第二控制信号是第一控制信号的补码。 第二和第三电压之间的电压差包括包括第一控制信号的放大的输出电压。

公开(公告)号：US20140133104A1

公开(公告)日：2014-05-15

申请号：US13675084

申请日：2012-11-13

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Eladio Clemente Delgado ,  John Stanley Glaser ,  Brian Lynn Rowden

IPC: H05K7/20

CPC classification number: H01L24/19 ,  H01L23/3735 ,  H01L23/49805 ,  H01L23/49844 ,  H01L23/49894 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/92144 ,  H01L2225/1035 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00

Abstract: A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).

Abstract translation: 表面安装封装包括至少一个半导体器件和围绕所述至少一个半导体器件形成的POL封装和互连系统，该半导体器件被配置为能够将表面贴装封装安装到外部电路。 POL系统包括覆盖半导体器件的第一表面的电介质层和延伸穿过通过介电层形成的通孔的金属互连结构，以便电耦合到半导体器件上的连接焊盘。 在包括平面结构的金属互连结构上形成金属化层，并且双面陶瓷衬底位于半导体器件的第二表面上，双面陶瓷衬底被配置为电隔离 当表面安装封装与其连接时，半导体器件从外部电路漏极，并将热量从半导体器件导出。

公开(公告)号：US09853555B2

公开(公告)日：2017-12-26

申请号：US14856657

申请日：2015-09-17

Applicant: General Electric Company

Inventor： Ramanujam Ramabhadran ,  Han Peng ,  Yehuda Daniel Levy ,  John Stanley Glaser

IPC: H02M7/5383 ,  H02M3/335 ,  H05B37/02 ,  H02M1/00

CPC classification number: H02M3/33546 ,  H02M2001/0058 ,  H05B33/0815 ,  H05B37/02 ,  Y02B70/1491

Abstract: A universal power adapter includes a power converter configured to generate an output power based on a switching frequency of the power converter. The universal power adapter also includes a frequency controller operatively coupled to the power converter and configured to control the switching frequency of the power converter. The universal power adapter further includes a switch capacitor circuit having a plurality of capacitive elements, operatively coupled to the power converter. The switch capacitor circuit is configured to switch between the plurality of capacitive elements. The universal power adapter also includes a capacitance controller operatively coupled to the switch capacitor circuit and configured to control the switch capacitor circuit to control switching between the plurality of capacitive elements to maintain a control parameter within a threshold range of.