公开(公告)号：US10224262B2

公开(公告)日：2019-03-05

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.

公开(公告)号：US20180331011A1

公开(公告)日：2018-11-15

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/367 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/552 ,  H01L23/562

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.

公开(公告)号：US10283487B2

公开(公告)日：2019-05-07

申请号：US15826799

申请日：2017-11-30

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Luke G. England ,  Kathryn C. Rivera

IPC: H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H01L21/683 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L25/065 ,  H01L21/3105

Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.

公开(公告)号：US09865570B1

公开(公告)日：2018-01-09

申请号：US15431915

申请日：2017-02-14

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Luke G. England ,  Kathryn C. Rivera

IPC: H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/29 ,  H01L23/522 ,  H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L21/3105 ,  H01L21/02 ,  H01L21/78 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10

CPC classification number: H01L25/0657 ,  H01L21/02164 ,  H01L21/02178 ,  H01L21/31053 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/04 ,  H01L23/10 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/5226 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73204 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.

公开(公告)号：US09401315B1

公开(公告)日：2016-07-26

申请号：US14669775

申请日：2015-03-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Paul F. Bodenweber ,  Taryn J. Davis ,  Marcus E. Interrante ,  Chenzhou Lian ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Hilton T. Toy

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/492 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83201 ,  H01L2224/83447 ,  H01L2224/83493 ,  H01L2224/839 ,  H01L2224/83901 ,  H01L2924/16747 ,  H01L2924/16793 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/00014

Abstract: A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.

Abstract translation: 一种半导体器件封装，其包括半导体封装，与半导体封装相连接的半导体器件; 以及放置在半导体器件上并连接到半导体封装的盖子。 所述盖包括：第一材料的块，具有第一表面和第二表面，所述第二表面面向所述半导体器件，所述块具有在所述第一表面和所述第二表面之间延伸的穿孔; 用于填充穿孔的插入件，每个插入件由第二材料制成，至少一个插入件朝向半导体器件突出超过第二表面; 以及接合材料，以将所述插入件结合到所述块，使得所述插入件中的所述至少一个插入件朝向所述半导体器件突出超过所述第二表面。 还包括组装半导体器件封装的方法。

公开(公告)号：US20180233488A1

公开(公告)日：2018-08-16

申请号：US15826799

申请日：2017-11-30

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Luke G. England ,  Kathryn C. Rivera

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/04 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L23/00 ,  H01L25/00 ,  H01L21/3105

CPC classification number: H01L25/0657 ,  H01L21/02164 ,  H01L21/02178 ,  H01L21/31053 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/04 ,  H01L23/10 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/5226 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161

Abstract: Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.