METHODS AND CONTROLLERS FOR CONTROLLING FOCUS OF ULTRAVIOLET LIGHT FROM A LITHOGRAPHIC IMAGING SYSTEM, AND APPARATUSES FOR FORMING AN INTEGRATED CIRCUIT EMPLOYING THE SAME
    1.
    发明申请
    METHODS AND CONTROLLERS FOR CONTROLLING FOCUS OF ULTRAVIOLET LIGHT FROM A LITHOGRAPHIC IMAGING SYSTEM, AND APPARATUSES FOR FORMING AN INTEGRATED CIRCUIT EMPLOYING THE SAME 审中-公开
    用于控制来自地平面成像系统的超紫外线聚焦的方法和控制器,以及用于形成使用其的集成电路的装置

    公开(公告)号:US20160033879A1

    公开(公告)日:2016-02-04

    申请号:US14446784

    申请日:2014-07-30

    CPC classification number: G03F7/70641

    Abstract: Methods and controllers for controlling focus of ultraviolet light produced by a lithographic imaging system, and apparatuses for forming an integrated circuit employing the same are provided. In an embodiment, a method includes providing a wafer having a resist film disposed thereon. The resist film is patterned through illumination of a lithography mask with ultraviolet light at an off-normal incidence angle with a first test pattern formed at a first pitch and a second test pattern formed at a second pitch different from the first pitch. Non-telecentricity induced shift of the first and second test patterns is measured to produce relative shift data using a measurement device. Focus of the ultraviolet light is adjusted based upon comparison of the relative shift data to a pre-determined correlation between the non-telecentricity induced shift of the first and second test patterns as a function of focus error.

    Abstract translation: 提供了用于控制由光刻成像系统产生的紫外光的焦点的方法和控制器,以及用于形成使用该光学成像系统的集成电路的装置。 在一个实施例中,一种方法包括提供其上设置有抗蚀剂膜的晶片。 通过以与第一间距形成的第一测试图案和以第一间距不同的第二间距形成的第二测试图案以非法入射角的紫外光照射光刻掩模来对抗蚀剂膜进行图案化。 测量第一和第二测试图案的非远心引起的偏移,以使用测量装置产生相对移位数据。 基于相对移位数据与作为焦点误差的函数的第一和第二测试图案的非远心引起的偏移之间的预定相关性进行比较来调整紫外线的焦点。

    Chemical and physical templates for forming patterns using directed self-assembly materials
    3.
    发明授权
    Chemical and physical templates for forming patterns using directed self-assembly materials 有权
    用于使用定向自组装材料形成图案的化学和物理模板

    公开(公告)号:US08790522B1

    公开(公告)日:2014-07-29

    申请号:US13764051

    申请日:2013-02-11

    CPC classification number: B44C1/227 H01L21/0337

    Abstract: A method includes forming a chemical guide layer above a process layer. A template having a plurality of elements is formed above the process layer. The chemical guide layer is disposed on at least portions of the process layer disposed between adjacent elements of the template. A directed self-assembly layer is formed over the chemical guide layer. The directed self-assembly layer has alternating etchable components and etch-resistant components. The etchable components of the directed self-assembly layer are removed. The process layer is patterned using the template and the etch-resistant components of the directed self-assembly layer as an etch mask.

    Abstract translation: 一种方法包括在处理层之上形成化学引导层。 具有多个元件的模板形成在处理层的上方。 化学引导层设置在设置在模板的相邻元件之间的处理层的至少一部分上。 导向的自组装层形成在化学引导层上。 定向自组装层具有交替的可蚀刻部件和耐蚀刻部件。 去除了定向自组装层的可蚀刻部件。 使用模板和定向自组装层的耐蚀刻部件作为蚀刻掩模对工艺层进行图案化。

    ASYMMETRIC TEMPLATES FOR FORMING NON-PERIODIC PATTERNS USING DIRECTES SELF-ASSEMBLY MATERIALS
    4.
    发明申请
    ASYMMETRIC TEMPLATES FOR FORMING NON-PERIODIC PATTERNS USING DIRECTES SELF-ASSEMBLY MATERIALS 有权
    使用方向自组装材料形成非定期图案的不对称模板

    公开(公告)号:US20140154630A1

    公开(公告)日:2014-06-05

    申请号:US13693627

    申请日:2012-12-04

    CPC classification number: G03F7/0002

    Abstract: A method includes forming a template having a plurality of elements above a process layer, wherein portions of the process layer are exposed between adjacent elements of the template. A directed self-assembly layer is formed over the exposed portions. The directed self-assembly layer has alternating etchable components and etch-resistant components. The etchable components of the directed self-assembly layer are removed. The process layer is patterned using the template and the etch-resistant components of the directed self-assembly layer. Non-periodic elements are defined in the process later by the template and periodic elements are defined in the process layer by the etch-resistant components of the directed self-assembly layer.

    Abstract translation: 一种方法包括在处理层之上形成具有多个元素的模板,其中处理层的部分在模板的相邻元素之间露出。 在暴露部分上形成定向的自组装层。 定向自组装层具有交替的可蚀刻部件和耐蚀刻部件。 去除了定向自组装层的可蚀刻部件。 使用模板和定向自组装层的耐蚀刻部件对工艺层进行图案化。 非周期元素在该过程中由模板定义,并且周期元素由定向自组装层的耐蚀刻部件在工艺层中定义。

    Asymmetric templates for forming non-periodic patterns using directed self-assembly materials
    5.
    发明授权
    Asymmetric templates for forming non-periodic patterns using directed self-assembly materials 有权
    使用定向自组装材料形成非周期性图案的不对称模板

    公开(公告)号:US08956808B2

    公开(公告)日:2015-02-17

    申请号:US13693627

    申请日:2012-12-04

    CPC classification number: G03F7/0002

    Abstract: A method includes forming a template having a plurality of elements above a process layer, wherein portions of the process layer are exposed between adjacent elements of the template. A directed self-assembly layer is formed over the exposed portions. The directed self-assembly layer has alternating etchable components and etch-resistant components. The etchable components of the directed self-assembly layer are removed. The process layer is patterned using the template and the etch-resistant components of the directed self-assembly layer. Non-periodic elements are defined in the process later by the template and periodic elements are defined in the process layer by the etch-resistant components of the directed self-assembly layer.

    Abstract translation: 一种方法包括在处理层之上形成具有多个元素的模板,其中处理层的部分在模板的相邻元素之间露出。 在暴露部分上形成定向的自组装层。 定向自组装层具有交替的可蚀刻部件和耐蚀刻部件。 去除了定向自组装层的可蚀刻部件。 使用模板和定向自组装层的耐蚀刻部件对工艺层进行图案化。 非周期元素在该过程中由模板定义,并且周期元素由定向自组装层的耐蚀刻部件在工艺层中定义。

    CHEMICAL AND PHYSICAL TEMPLATES FOR FORMING PATTERNS USING DIRECTED SELF-ASSEMBLY MATERIALS
    6.
    发明申请
    CHEMICAL AND PHYSICAL TEMPLATES FOR FORMING PATTERNS USING DIRECTED SELF-ASSEMBLY MATERIALS 有权
    使用方向自组装材料形成图案的化学和物理模板

    公开(公告)号:US20140224764A1

    公开(公告)日:2014-08-14

    申请号:US13764051

    申请日:2013-02-11

    CPC classification number: B44C1/227 H01L21/0337

    Abstract: A method includes forming a chemical guide layer above a process layer. A template having a plurality of elements is formed above the process layer. The chemical guide layer is disposed on at least portions of the process layer disposed between adjacent elements of the template. A directed self-assembly layer is formed over the chemical guide layer. The directed self-assembly layer has alternating etchable components and etch-resistant components. The etchable components of the directed self-assembly layer are removed. The process layer is patterned using the template and the etch-resistant components of the directed self-assembly layer as an etch mask.

    Abstract translation: 一种方法包括在处理层之上形成化学引导层。 具有多个元件的模板形成在处理层的上方。 化学引导层设置在设置在模板的相邻元件之间的处理层的至少一部分上。 导向的自组装层形成在化学引导层上。 定向自组装层具有交替的可蚀刻部件和耐蚀刻部件。 去除了定向自组装层的可蚀刻部件。 使用模板和定向自组装层的耐蚀刻部件作为蚀刻掩模对工艺层进行图案化。

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