摘要:
An automated analysis system that identifies detectability problems, diagnosability problems, and possible ways to change rank order of diagnoses in a diagnostic system and makes the problems and possible improvements visible to test programmers to aid in test improvement. Components that have no coverage and components that have inadequate coverage (according to a heuristic criteria) are identified as potential detectability problems. Components that are exercised by identical operations in all tests are identified as diagnosability problems. If an incorrect diagnosis is made, the automated analysis system identifies failing tests that have no coverage of any component in the true failure cause. In addition, if an incorrect diagnosis is made, the automated analysis system identifies ways of changing the rank order of diagnoses, including coverages that can be reduced and identification of operation violations that can be eliminated or deliberately added. If no historical data are available, a "diagnosability index" may be computed by randomly sampling from the set of possible failure syndromes and observing the frequencies with which ties occur among the weights of the top-ranked candidate diagnoses. After historical data becomes available, a diagnosability index may be computed from the frequency with which two candidate diagnoses are assigned identical weights by the model-based diagnostic system over a set of representative failures.
摘要:
A method for testing node interconnection on a circuit board. The method utilizes an automated test system having at least one test channel, wherein each test channel has a digital driver with a first input and a first output, and a digital receiver with a second output and a second input. The second input of the receiver is coupled to the first output of the driver and to a test probe. The test probe is configured to couple the driver and receiver to one of a plurality of nodes on a circuit board. During a node interconnection test, a first selected node is coupled to a first test channel, and it is determined whether the first selected node is connected to ground. If the first selected node is not connected to ground, a second selected node is connected to ground; a test signal is applied to the first selected node via the digital driver of the first test channel; and it is determined whether the first selected node is connected to the second selected node.
摘要:
The invention is a capacitively coupled probe which can be used for non-contact acquisition of both analog and digital signals. The probe includes a shielded probe tip, a probe body which is mechanically coupled to the probe tip, and an amplifier circuit disposed within the probe body. The amplifier circuit receives a capacitively sensed signal from the probe tip and produces an amplified signal in response thereto. The amplifier has a large bandwidth to accommodate high-frequency digital signals. Further, the amplifier has a very low input capacitance and a high input resistance to reduce signal attenuation and loading of the circuit being probed. The amplifier circuit is disposed in the probe body closely adjacent to the probe tip in order to reduce stray and distributed capacitances. A reconstruction circuit reconstructs digital signals from the amplified capacitively sensed signal.
摘要:
In one embodiment, a method for designing a radiographic imaging system includes 1) receiving a number of design constraints for the system, and then 2) in response to the constraints, generating a plurality of radiographic imaging system designs, each having a different number of radiographic sources, and each requiring a different number of nominal scan passes to image a specimen region of interest. Designs having a greater number of radiographic sources have sets of translated radiographic detection areas sharing at least some coincident, nominal scan passes as compared to radiographic imaging system designs having fewer radiographic sources. Each set of translated radiographic detection areas is associated with a radiographic source that is replicated and translated with respect to a radiographic source that forms part of a radiographic imaging system design having fewer radiographic sources. Related systems and apparatus are also disclosed.
摘要:
An automatic circuit board tester for testing for shorts, opens, and interconnected pins or nodes on a circuit board. The tester first classifies the nodes as being in one of three categories based upon the design of the board and the intended interconnection of the nodes. The categories of nodes are: (1) connected to ground; (2) interconnected to all other nodes in the test group; or (3) isolated from all other nodes. The circuit board tester has a testhead containing a plurality of test channels, each configured to be coupled to a node on the circuit board. The testhead utilizes a digital signal from a digital driver to drive the node, at a predetermined voltage and a digital receiver to read the node voltage to determine if it is coupled to ground. Each test channel also includes a switch to connect the digital driver and receiver to the test node as well as a ground switch to selectively couple the node to ground. Various combinations of switch positions and testing sequences enables the circuit board tester to test all node connections and to ensure that the physical embodiment of the circuit board accurately reflects the circuit board design.
摘要:
A method and apparatus for analyzing a semiconductor device having a diode formed therein. In its broadest sense, the invention involves irradiating the semiconductor device with electromagnetic radiation while monitoring the leakage current output from the diode contained in the semiconductor device. If the semiconductor device is present and properly soldered to the printed circuit board, an increase in the leakage current will be observed during the irradiation process. The increase in leakage current is also representative of the presence of intact bond wires at both the pin under test and the ground pin. The invention in a preferred form is shown to include a voltage source, electrically connected to the diode, for biasing the diode in a reverse direction, a current monitor, connected to monitor the leakage current from the diode and an electromagnetic radiation generator, positioned to provide electromagnetic radiation incident on the semiconductor device. It is preferred that the electromagnetic radiation be an ionizing radiation such as X-rays. However, such electromagnetic radiation can also be visible light, such as fluorescent light or incandescent light. In an especially preferred embodiment, the semiconductor device is first exposed to electromagnetic radiation, and thereafter the diode is biased in a reverse direction.
摘要:
Apparatus for classifying beats in EKG signals from two sets of electrodes in which the respective signals are applied to different channels and the classification is derived from a simultaneous analysis of the signals provided by the two channels based on the quality of the channels and physiological factors of the signals.
摘要:
A system and method for performing auto-focusing operations for tomosynthetic reconstruction of images are provided. More specifically, embodiments of the present invention provide a system and method for efficiently computing the gradient of one or more depth layers of an object under inspection, wherein such gradients may be used in performing auto-focusing operations to determine a depth layer that includes an in-focus view of a feature that is of interest. In at least one embodiment, a method is provided that comprises capturing detector image data for an object under inspection, and using the detector image data for computing gradient information for at least one depth layer of the object under inspection without first tomosynthetically reconstructing a full image of the at least one depth layer.
摘要:
An X-ray inspection system incorporates an improved technique for determining, in an X-ray image of a multilayered assembly, the gray level component of a first material in the presence of a second material. The total gray level of the image is dependent upon the physical characteristics of each material comprising the assembly. The present invention accurately determines the component of the total image gray level due to the first material. In the case of circuit board inspections using X-ray images of solder connections, a calibration procedure facilitates the direct conversion of the gray level component due to the solder connection to the thickness of the solder connection.
摘要:
A method for testing node isolation on a circuit board. The method utilizes an automated test system having a plurality of test channels, wherein each test channel has a digital driver with a first input and a first output, and a digital receiver with a second output and a second input. The second input of the receiver is coupled to the first output of the driver, to a number of switches, and to a test probe. The test probe is configured to couple the driver and receiver to one of a plurality of nodes on a circuit board. The number of switches are configured to selectively couple the first output and second input to ground. During a node isolation test, each node of a test node group is coupled to one of the test channels. But for a selected node of the test node group, each node of the test node group is coupled to ground via the number of switches of the test channels coupled to the nodes. Thereafter, a test signal is applied to the selected node via the digital driver of a first test channel which is coupled to the selected node. It is then determined if the digital receiver of the first test channel indicates that the selected node is coupled to ground, and whether the selected node is isolated from the remaining nodes of the test node group. If the selected node is not isolated from the remaining nodes of the test node group, the nodes of the test node group are released from ground, a test signal is once again applied to the selected node, and a determination is made as to whether the selected node is grounded to thereby determine if the selected node is directly connected to ground. Finally, if the selected node is not directly connected to ground, varying subsets of the remaining nodes are coupled to ground, a test signal is once again applied to the selected node, and a determination is made as to whether the selected node is grounded to thereby determine which nodes of the test node group the selected node is isolated from.