利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.024 秒)

    Microelectronic die having a thermoelectric module
    4.
    发明申请
    Microelectronic die having a thermoelectric module 有权
    具有热电模块的微电子管芯

    公开(公告)号：US20050029637A1

    公开(公告)日：2005-02-10

    申请号：US10638038

    申请日：2003-08-08

    申请人： Chuan Hu ,  Gregory Chrysler ,  Ravi Mahajan

    发明人： Chuan Hu ,  Gregory Chrysler ,  Ravi Mahajan

    IPC分类号： H01L23/38 ,  H01L23/495

    CPC分类号： H01L23/38 ,  H01L2224/73253 ,  H01L2924/16195

    摘要： A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.

    摘要翻译： 提供具有集成热电模块的微电子管芯。 微电子管芯具有管芯基板，形成在管芯基板的前侧的微电子电路，以及位于管芯基板背面的热电模块。 衬底中的通孔将热电模块与模具衬底的前侧上的电源和接地平面互连。

    Computer system having controlled cooling
    5.
    发明申请
    Computer system having controlled cooling 有权
    具有控制冷却的计算机系统

    公开(公告)号：US20050078451A1

    公开(公告)日：2005-04-14

    申请号：US10683924

    申请日：2003-10-10

    申请人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

    发明人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

    IPC分类号： G06F1/20 ,  H03K17/955 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F1/206 ,  G06F2200/201

    摘要： A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

    摘要翻译： 提供了一种计算机系统及其冷却方法。 蒸气室用作来自微电子管芯的热量的散热器。 热电模块用于冷却蒸气室并保持蒸气室的适当功能，从而保持微电子模具的冷却。 控制器从五个温度传感器接收输入，并利用输入来控制热电模块的电流和驱动风扇的电机的电压/电流，并提供额外的冷却。 电流传感器允许控制器监测和限制提供给热电模块的功率。

    INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH MANIFOLD MEMBER THAT FACILITATES COOLANT LINE ATTACHMENT
    6.
    发明申请
    INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH MANIFOLD MEMBER THAT FACILITATES COOLANT LINE ATTACHMENT 有权
    集成电路冷凝器微通道组件与配件成员冷却线连接

    公开(公告)号：US20080068792A1

    公开(公告)日：2008-03-20

    申请号：US11942158

    申请日：2007-11-19

    申请人： Je-Young Chang ,  Gregory Chrysler

    发明人： Je-Young Chang ,  Gregory Chrysler

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plurality of walls coupled to the microchannel structure to define a manifold. The manifold is in communication with at least a plurality of the microchannels. The plurality of walls includes a side wall. The side wall has a port therein. The port allows the coolant to flow in a direction that is either into the manifold or out of the manifold.

    摘要翻译： 一种装置包括其中形成有微通道的微通道结构。 微通道将传输冷却剂并且靠近集成电路以将热量从集成电路传递到冷却剂。 该装置还包括耦合到微通道结构以限定歧管的多个壁。 歧管与至少多个微通道连通。 多个壁包括侧壁。 侧壁上有一个端口。 端口允许冷却剂沿着或者进入歧管或歧管内的方向流动。

    Localized microelectronic cooling apparatuses and associated methods and systems
    8.
    发明申请
    Localized microelectronic cooling apparatuses and associated methods and systems 有权
    本地化微电子冷却装置及相关方法和系统

    公开(公告)号：US20070144182A1

    公开(公告)日：2007-06-28

    申请号：US11319297

    申请日：2005-12-27

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： F25B21/02 ,  F25D23/12

    CPC分类号： F25B21/02 ,  F25D19/006 ,  H01L23/3677 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/12044

    摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.

    摘要翻译： 通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。 在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。

    Application and removal of thermal interface material
    9.
    发明申请
    Application and removal of thermal interface material 有权
    热界面材料的应用和去除

    公开(公告)号：US20070068173A1

    公开(公告)日：2007-03-29

    申请号：US11599671

    申请日：2006-11-14

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： F25B21/02

    CPC分类号： F28D15/02 ,  H01L23/38 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00

    摘要： A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

    摘要翻译： 描述了一种方法，系统和装置。 该装置包括用于调节与热电（TEC）模块相关联的极性的第一装置。 调整是为了控制热量的流动。 热流导向热界面材料（TIM），以便将TIM熔化到可接受的熔体水平。 该装置还包括第二装置，用于确定TIM已经熔化到可接受的熔融水平。 该装置包括一个施加装置，用于将TIM施加到散热器上，如果TIM熔化已熔化到可接受的熔融水平。