公开(公告)号：US12036734B2

公开(公告)日：2024-07-16

申请号：US17298898

申请日：2019-07-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Melanie M. Gottwals ,  Ingeborg Tastl ,  Aja Hartman ,  Adekunle Olubummo

IPC: B29C64/264 ,  B29C35/08 ,  B29C64/165 ,  B29C64/336 ,  B29C71/04 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  C09D7/48 ,  C09D7/63 ,  C09D177/02 ,  B29K77/00

CPC classification number: B29C64/165 ,  B29C35/0805 ,  B33Y10/00 ,  B33Y70/00 ,  C09D7/48 ,  C09D7/63 ,  C09D177/02 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29K2077/00

Abstract: A three-dimensional printing method can include iteratively applying polymer build material as individual layers; based on a three-dimensional object model, selectively jetting an electromagnetic radiation absorber and a translucency-modulating plasticizer onto individual layers of the polymer build material; and exposing the powder bed to electromagnetic energy to selectively fuse portions of individual layers of the polymer build material together to form a three-dimensional object. The polymer build material can include from about 60 wt % to 100 wt % polymeric particles having an average particle size from about 10 ?m to about 150 ?m and a degree of crystallinity from about 2% to about 60%, to a powder bed. At the locations where the polymer build material includes jetted translucency-modulating plasticizer, the three-dimensional object can exhibit an optical transmittance from about 5% to about 80%.

公开(公告)号：US11904537B2

公开(公告)日：2024-02-20

申请号：US17824197

申请日：2022-05-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Lihua Zhao

IPC: B29C64/165 ,  B29C64/295 ,  B29C64/209 ,  B29C64/268 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y30/00

CPC classification number: B29C64/165 ,  B29C64/209 ,  B29C64/268 ,  B29C64/295 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y30/00

Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.

公开(公告)号：US20240042680A1

公开(公告)日：2024-02-08

申请号：US18379071

申请日：2023-10-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Paul Olubummo ,  Kristopher J. Erickson ,  Aja Hartman ,  Lihua Zhao

IPC: B29C64/124 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/314 ,  B29C64/165 ,  B29C64/218 ,  B33Y40/10

CPC classification number: B29C64/124 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/314 ,  B29C64/165 ,  B29C64/218 ,  B33Y40/10

Abstract: In an example, a three-dimensional (3D) printed part comprises a plurality of fused build material layers including exterior layers and interior layers. At least some of the interior layers include a composite portion having a miscible solid physically bonded to an amide functionality or an amine functionality of the build material. The miscible solid is a solid at a room temperature ranging from about 18° C. to about 25° C.

公开(公告)号：US11822995B2

公开(公告)日：2023-11-21

申请号：US17414789

申请日：2019-04-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： M. Anthony Lewis ,  William J. Allen ,  Douglas Pederson ,  Jarrid Wittkopf ,  Kristopher J. Erickson ,  Robert Ionescu

IPC: G06K7/10 ,  G06K19/067

CPC classification number: G06K7/10009 ,  G06K19/0672

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes at least one directional antenna to 1) emit energy waves towards a mass in which an object is disposed and 2) receive reflected signals from a resonator disposed on the object as the mass is moved relative to the directional antenna. The system also includes a controller to, based on received reflected signals, determine a pose of the object within the mass.

公开(公告)号：US20230296547A1

公开(公告)日：2023-09-21

申请号：US18019703

申请日：2020-08-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jarrid Wittkopf ,  Eric Luna-Ramirez ,  Kristopher J. Erickson ,  James William Stasiak

IPC: G01N27/22

CPC classification number: G01N27/227 ,  G01N27/223

Abstract: In one example in accordance with the present disclosure, a three-dimensional (3D) printed sensor system is described. The 3D printed sensor system includes a 3D printed object. The 3D printed sensor system also includes a 3D printed sensor on a body of the 3D printed object. The 3D printed sensor includes a dielectric region disposed between electrodes. A capacitance of the dielectric region is indicative of an environmental condition of the 3D printed object. The 3D printed sensor system also includes a controller integrated with the body of the 3D printed object. The controller is to measure a capacitance of the 3D printed sensor.

公开(公告)号：US11759996B2

公开(公告)日：2023-09-19

申请号：US16978869

申请日：2018-04-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Anthony McLennan ,  Lihua Zhao

IPC: B29C64/106 ,  B29C64/264 ,  B29C64/188 ,  B22F12/13 ,  B22F12/30 ,  B22F10/64 ,  B22F1/054 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B22F10/25 ,  B22F10/28 ,  B22F10/39

CPC classification number: B29C64/106 ,  B22F1/054 ,  B22F10/64 ,  B22F12/13 ,  B22F12/30 ,  B29C64/188 ,  B29C64/264 ,  B22F10/25 ,  B22F10/28 ,  B22F10/39 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20

Abstract: An example system includes a three-dimensional (3D) printer to generate a 3D object and a surface feature formation arrangement to receive the 3D object. The 3D object has at least one surface with a layer of at least partly uncured material. The surface feature formation arrangement includes a controller and a heat source. The controller is to operate the heat source to selectively apply heat to the at least one surface of the 3D object. The heat from the heat source is to transform the at least partly uncured material to form a selected feature on the at least one surface.

公开(公告)号：US11648731B2

公开(公告)日：2023-05-16

申请号：US15763200

申请日：2015-10-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Thomas Anthony ,  Howard S. Tom ,  Sivapackia Ganapathiappan ,  Lihua Zhao ,  Krzysztof Nauka

IPC: B29C64/00 ,  B29C64/165 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  B29C67/00 ,  C09B47/06 ,  C09B47/24 ,  C09B47/067 ,  B33Y40/00 ,  B29C64/40 ,  B29C64/176 ,  B29C64/10 ,  B29C64/182 ,  B33Y99/00 ,  B29C64/25 ,  B33Y40/10 ,  B33Y50/00 ,  B29C64/205 ,  B29C64/307 ,  B29C64/245 ,  B33Y40/20 ,  B29C64/255 ,  B29C64/30 ,  B29C64/227 ,  B22F10/28 ,  B22F10/50 ,  B33Y30/00 ,  B29C64/20 ,  B29C64/393

CPC classification number: B29C64/165 ,  B22F10/28 ,  B22F10/50 ,  B29C64/00 ,  B29C64/10 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/30 ,  B29C64/307 ,  B29C64/393 ,  B29C64/40 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  C09B47/065 ,  C09B47/0678 ,  C09B47/24 ,  B22F2999/00 ,  G03G2215/2054 ,  G05B2219/49023 ,  G05B2219/49246 ,  Y10T156/1722 ,  Y10T156/1798 ,  B22F2999/00 ,  B22F10/10 ,  B22F1/105 ,  B22F1/107 ,  B22F1/054 ,  B22F2999/00 ,  B22F1/054 ,  B22F1/105 ,  B22F10/10 ,  B22F1/107 ,  B22F2999/00 ,  B22F10/28 ,  B22F1/06 ,  B22F1/107 ,  B22F1/054

Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

公开(公告)号：US11413815B2

公开(公告)日：2022-08-16

申请号：US16076338

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Lihua Zhao

IPC: B29C64/165 ,  B29C64/295 ,  B29C64/209 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.

公开(公告)号：US20220138374A1

公开(公告)日：2022-05-05

申请号：US17414520

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: G06F30/20

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, a design file for the part. A modifier of the system receives user input modifying the design file and a transmitter transmits the modified design file for production of the part.

公开(公告)号：US20220097308A1

公开(公告)日：2022-03-31

申请号：US17415079

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/386 ,  B33Y50/00 ,  B33Y10/00 ,  B33Y30/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.