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22 条记录 (耗时 0.05 秒)

    Benzopyran derivatives substituted with a benzimidazole derviative, pharmaceutically acceptable salts thereof, their preparations and pharmaceutical compositions containing them
    1.
    发明申请
    Benzopyran derivatives substituted with a benzimidazole derviative, pharmaceutically acceptable salts thereof, their preparations and pharmaceutical compositions containing them 失效
    被苯并咪唑衍生物取代的苯并吡喃衍生物，其药学上可接受的盐，其制剂和含有它们的药物组合物

    公开(公告)号：US20060293376A1

    公开(公告)日：2006-12-28

    申请号：US10558020

    申请日：2004-05-28

    申请人： Hong Lim ,  Dong Lee ,  San Kim ,  Sung-Eun Yoo ,  Kyu Yi ,  Sun Lee ,  Jee Suh ,  Nak Kim ,  Sun Hwang ,  Tae Kim ,  Byung Lee ,  Ho-Won Seo

    发明人： Hong Lim ,  Dong Lee ,  San Kim ,  Sung-Eun Yoo ,  Kyu Yi ,  Sun Lee ,  Jee Suh ,  Nak Kim ,  Sun Hwang ,  Tae Kim ,  Byung Lee ,  Ho-Won Seo

    IPC分类号： A61K31/4184 ,  C07D405/04

    CPC分类号： C07D405/04 ,  C07D405/14

    摘要： The present invention relates to benzopyran derivatives substituted with a benzimidazole derivative, or pharmaceutically acceptable salts thereof, a preparation method of the same and pharmarceutical compositions containing them. Benzopyran derivatives substituted with a benzimidazole derivative, represented in Formula (1), have the function of protecting heart from ischemia-reperfusion without side effect like vasodilation, so that a pharmaceutical composition containing benzopyran derivatives substituted with a benzimidazole derivative or pharmaceutically acceptable salts thereof of the present invention as an effective ingredient can be effectively used for the protection of tissues influenced by ischemia-reperfusion, for example, for the protection of heart, nervous cells, brain, retinal cells, storage organs, etc. and for the treatment of diseases caused by ischemia-reperfusion.

    摘要翻译： 本发明涉及被苯并咪唑衍生物取代的苯并吡喃衍生物或其药学上可接受的盐，其制备方法和含有它们的药物组合物。 由式（1）表示的苯并咪唑衍生物取代的苯并吡喃衍生物具有保护心脏免于缺血再灌注而无副作用如血管舒张的功能，因此含有苯并咪唑衍生物或其药学上可接受的盐取代的苯并吡喃衍生物的药物组合物 作为有效成分的本发明可以有效地用于保护受缺血再灌注影响的组织，例如用于保护心脏，神经细胞，脑，视网膜细胞，储存器官等，并用于治疗疾病 由缺血再灌注引起。

    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
    8.
    发明申请
    Integrated heatspreader for use in wire bonded ball grid array semiconductor packages 有权
    集成式散热器，适用于线栅球栅阵列半导体封装

    公开(公告)号：US20060055029A1

    公开(公告)日：2006-03-16

    申请号：US10939082

    申请日：2004-09-10

    申请人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    发明人： Maurice Othieno ,  Hong Lim ,  Qwai Low

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat spreader mounted on the substrate. An IC die is mounted to the heat spreader such that the heat spreader lies in between the die and the substrate. The invention is also directed to a heat spreader plate useable in a semiconductor package. The heat spreader plate comprises a plate comprised of thermally conductive material suitable for attachment to a packaging substrate wherein the plate includes openings for exposing electrical bonding surfaces of a packaging substrate when the heater spreader plate is mounted on the packaging substrate. Such openings enable wirebonding between the exposed electrical bonding surfaces of the substrate and an integrated circuit die to complete construction of a package including the heatspreader.

    摘要翻译： 本发明涉及用于在这种包装和系统中提供改进的热性能的系统，包装和方法。 本发明的实施例包括具有安装在基板上的散热器的基板的半导体集成电路（IC）封装。 IC散热器安装在散热器上，使得散热器位于模具和基板之间。 本发明还涉及可用于半导体封装的散热板。 散热板包括由适于附接到包装基板的导热材料构成的板，其中，当加热器散布板安装在包装基板上时，该板包括用于暴露包装基板的电接合表面的开口。 这种开口使得能够在基板的暴露的电接合表面和集成电路管芯之间进行引线接合，以完成包括散热器的封装的构造。

    Wireles switching control system for building automation, lighting, security and appliances
    10.
    发明申请
    Wireles switching control system for building automation, lighting, security and appliances 审中-公开
    用于楼宇自动化，照明，安全和电器的线缆切换控制系统

    公开(公告)号：US20070293208A1

    公开(公告)日：2007-12-20

    申请号：US11818694

    申请日：2007-06-15

    申请人： Kuam Loh ,  Hong Lim

    发明人： Kuam Loh ,  Hong Lim

    IPC分类号： H04M3/00

    CPC分类号： H04L12/282 ,  H04L2012/2841

    摘要： The present disclosure discloses an expandable wireless control system for and a method of managing and controlling building automation, lighting system, security system and electrical appliances. This system, based on a concept of modular mailboxes intercommunicating wirelessly by radio frequency and infrared frequency, can be used in new homes and buildings or easily retrofitted into existing homes and buildings without any need for massive rewiring, comprises of: microprocessor control switch panel, handheld remote devices, user input interface device, wireless multipurpose transceiver unit (MPU, 300) that interpose with remotely controllable subsystem of third party devices and electrical appliances to enable control of these devices to become a part of said system, and a wireless multipurpose transceiver with communication interface (MPUCOM, 302) in combination with a graphical user interface software that turns a personal computer into a setup computer, command centre, remote management gateway that connects to internet and telecommunication network (702).

    摘要翻译： 本公开公开了一种用于管理和控制楼宇自动化，照明系统，安全系统和电器的可扩展无线控制系统和方法。 该系统基于通过射频和红外频率无线通信的模块化邮箱的概念，可以用于新建住宅和建筑物，或者轻松地改装到现有家庭和建筑物中，而无需大量重新布线，包括：微处理器控制开关面板， 手持式远程设备，用户输入接口设备，与第三方设备和电器的远程可控子系统相互配合的无线多功能收发单元（MPU300），以使得能够控制这些设备成为所述系统的一部分，以及无线多功能收发器 与通信接口（MPUCOM，302）结合图形用户界面软件，将个人计算机转换成连接到互联网和电信网络的安装计算机，命令中心，远程管理网关（702）。