公开(公告)号：US20170158934A1

公开(公告)日：2017-06-08

申请号：US15046973

申请日：2016-02-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Min-Chian WANG ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G73/14

CPC classification number: C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：US20190211138A1

公开(公告)日：2019-07-11

申请号：US16146084

申请日：2018-09-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Min-Chian WANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC: C08G59/22 ,  C08G59/50 ,  C08K3/22 ,  C08G59/24 ,  C08G59/52 ,  C08G59/56 ,  C09D163/00 ,  C09K5/14

CPC classification number: C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/52 ,  C08G59/56 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C09D163/00 ,  C09K5/14

Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.