公开(公告)号：US20240228854A1

公开(公告)日：2024-07-11

申请号：US18180609

申请日：2023-03-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiang-Yen TSAO ,  Hui-Wen CHANG ,  Jyh-Long JENG

IPC: C09K5/14 ,  C08G59/02 ,  C08G69/40

CPC classification number: C09K5/14 ,  C08G59/02 ,  C08G69/40

Abstract: A polymer is formed by reacting (a) benzaldazine compound with (b1) diamine compound, (b2) dianhydride compound, (b3) epoxy resin, or a combination thereof, wherein (a) benzaldazine compound has a chemical structure of




in which R1 is —NH2, —OH, or




The polymer can be combined with inorganic powder to form a thermal interface material.

公开(公告)号：US20170158934A1

公开(公告)日：2017-06-08

申请号：US15046973

申请日：2016-02-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Min-Chian WANG ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G73/14

CPC classification number: C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：US20170158932A1

公开(公告)日：2017-06-08

申请号：US14974616

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G59/50 ,  C08G59/22

CPC classification number: C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

公开(公告)号：US20150166347A1

公开(公告)日：2015-06-18

申请号：US14484430

申请日：2014-09-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Lung LIN ,  Yen-Chun LIU ,  Hui-Wen CHANG ,  Kuo-Chan CHIOU ,  Hsien-Lin HU

IPC: C01B31/04 ,  C08G73/14

CPC classification number: C01B31/04 ,  C01B32/20 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/14 ,  C09D179/08

Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.

Abstract translation: 提供由下式表示的聚酰胺 - 酰亚胺。 还提供了通过对由上述式表示的聚酰胺 - 酰亚胺进行热处理工艺制备的石墨膜。 在热处理过程中，热处理工艺的温度范围为25℃至2900℃。