公开(公告)号：US20180156863A1

公开(公告)日：2018-06-07

申请号：US15367415

申请日：2016-12-02

Applicant: Intel Corporation

Inventor： David Won-jun Song ,  James R. Hastings ,  Akhilesh P. Rallabandi ,  Morten S. Jensen ,  Christopher Wade Ackerman ,  Christopher R. Schroeder ,  Nader N. Abazarnia ,  John C. Johnson

IPC: G01R31/28 ,  H05B6/10

CPC classification number: G01R31/2875 ,  H05B6/06 ,  H05B6/10 ,  H05B6/105

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

公开(公告)号：US10281521B2

公开(公告)日：2019-05-07

申请号：US15367415

申请日：2016-12-02

Applicant: Intel Corporation

Inventor： David Won-jun Song ,  James R. Hastings ,  Akhilesh P. Rallabandi ,  Morten S. Jensen ,  Christopher Wade Ackerman ,  Christopher R. Schroeder ,  Nader N. Abazarnia ,  John C. Johnson

IPC: G01R31/10 ,  G01R31/28 ,  H05B6/10

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

公开(公告)号：US09448278B2

公开(公告)日：2016-09-20

申请号：US14746764

申请日：2015-06-22

Applicant: INTEL CORPORATION

Inventor： Christopher R. Schroeder ,  Christopher W. Ackerman ,  James C. Shipley ,  Tolga Acikalin ,  Ioan Sauciuc ,  Michael L. Rutigliano ,  James G. Maveety ,  Ashish Gupta

IPC: G01R31/28 ,  G01R31/26 ,  G06F1/20 ,  H01L23/473 ,  H01L23/467 ,  F28F3/12

CPC classification number: G01R31/2875 ,  F28F3/12 ,  G01R31/2642 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract translation: 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。