Methods and devices for securing and transporting singulated die in high volume manufacturing
    2.
    发明授权
    Methods and devices for securing and transporting singulated die in high volume manufacturing 有权
    用于在大批量生产中固定和运输单个模具的方法和装置

    公开(公告)号:US09496161B2

    公开(公告)日:2016-11-15

    申请号:US15050387

    申请日:2016-02-22

    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

    Abstract translation: 一种方法包括识别晶片上的多个管芯的晶片位置,将多个管芯中的每个管芯的晶片位置存储在数据库中,将晶片切割成多个单个管芯,将每个单模管芯定位在管芯中 在托盘上的位置位置,并将模具位置存储在数据库中的每个单个模具的托盘上。 数据库包括包括与每个模具位置相关联的晶片位置的信息。 托盘被运送到处理工具,并且多个分割模具中的至少一个从托盘上的模具位置移除并在处理工具中进行处理。 在处理之前,单独模具位于托盘上的相同的限定位置处理被处理的单个模具。 描述和要求保护其他实施例。

    Conformable heat spreader
    3.
    发明授权

    公开(公告)号:US10566263B2

    公开(公告)日:2020-02-18

    申请号:US15718337

    申请日:2017-09-28

    Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

    CONFORMABLE HEAT SPREADER
    5.
    发明申请

    公开(公告)号:US20190096785A1

    公开(公告)日:2019-03-28

    申请号:US15718337

    申请日:2017-09-28

    Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

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