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    REFLOWABLE GRID ARRAY TO SUPPORT GRID HEATING
    1.
    发明申请
    REFLOWABLE GRID ARRAY TO SUPPORT GRID HEATING 审中-公开

    公开(公告)号：US20200229294A1

    公开(公告)日：2020-07-16

    申请号：US16249499

    申请日：2019-01-16

    Applicant: Intel Corporation

    Inventor： Jonathan W. THIBADO ,  Jeffory L. SMALLEY ,  John C. GULICK ,  Phi THANH

    IPC: H05K1/02 ,  H01L23/36 ,  H01L23/498 ,  H01L21/50 ,  H01L21/48 ,  H05K1/18 ,  H05K1/11

    Abstract: Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a substrate having vias and zones, where the zones have embedded heaters. The heaters may include first traces, second traces, and via filament interconnects. The vias may have a z-height greater than a z-height of the heaters, and each of the zones may have a grid pattern. The RGA interposer may include first and second layers in the substrate, where the first layer includes the first traces, the second layer includes the second traces, and the second layer is over the first layer. The grid pattern may have parallel first traces orthogonal to parallel second traces to form a pattern of squares, where the pattern of squares has the first traces intersect the second traces substantially at right angles.

    SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY
    2.
    发明申请
    SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY 有权

    公开(公告)号：US20220208645A1

    公开(公告)日：2022-06-30

    申请号：US17696694

    申请日：2022-03-16

    Applicant: Intel Corporation

    Inventor： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

    IPC: H01L23/40

    Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

    REFLOWABLE GRID ARRAY AS STANDBY HEATER FOR RELIABILITY
    3.
    发明申请
    REFLOWABLE GRID ARRAY AS STANDBY HEATER FOR RELIABILITY 审中-公开

    公开(公告)号：US20200229309A1

    公开(公告)日：2020-07-16

    申请号：US16249512

    申请日：2019-01-16

    Applicant: Intel Corporation

    Inventor： Jonathan W. THIBADO ,  Jeffory L. SMALLEY ,  John C. GULICK ,  Phi THANH

    IPC: H05K3/34 ,  H01L23/36 ,  H01L23/498 ,  H01L21/50 ,  H01L21/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a plurality of heater traces in a substrate. The RGA interposer also includes a plurality of vias in the substrate. The vias extend vertically from the bottom surface to the top surface of the substrate. The RGA interposer may have one of the vias between two of the heater traces, wherein the vias have a z-height that is greater than a z-height of the heater traces. The heater traces may be embedded in a layer of the substrate, where the layer of the substrate is between top ends and bottom ends of the vias. Each of the plurality of heater traces may include a via filament interconnect coupled to a power source and a ground source. The heater traces may be resistive heaters.

    MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
    6.
    发明申请
    MULTI-CHIP SELF ADJUSTING COOLING SOLUTION 审中-公开

    公开(公告)号：US20190067158A1

    公开(公告)日：2019-02-28

    申请号：US16175712

    申请日：2018-10-30

    Applicant: Intel Corporation

    Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Mani PRAKASH ,  Tao LIU ,  Henry C. BOSAK ,  Harvey R. KOFSTAD ,  Almanzo T. ORTIZ

    IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H01L23/40

    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

    COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
    7.
    发明申请
    COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE 有权

    公开(公告)号：US20220117079A1

    公开(公告)日：2022-04-14

    申请号：US17555250

    申请日：2021-12-17

    Applicant: Intel Corporation

    Inventor： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

    IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

    Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

    MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
    10.
    发明申请
    MULTI-CHIP SELF ADJUSTING COOLING SOLUTION 审中-公开
    多芯片自调节冷却液

    公开(公告)号：US20160276243A1

    公开(公告)日：2016-09-22

    申请号：US14767843

    申请日：2014-09-27

    Applicant: INTEL CORPORATION

    Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Mani PRAKASH ,  Tao LIU ,  Henry C. BOSAK ,  Almanzo T. ORTIZ

    IPC: H01L23/367 ,  H01L25/065 ,  H01L23/433

    CPC classification number: H01L23/3677 ,  H01L23/3675 ,  H01L23/4093 ,  H01L23/4338 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

    Abstract translation: 一种装置，包括主要装置和至少一个辅助装置，其以平面阵列耦合到基板; 第一被动式热交换器，其设置在所述主装置上并且在对应于所述至少一个次级装置的区域上具有开口; 设置在所述至少一个次级装置上的第二被动热交换器; 至少一个第一弹簧，其可操作以在所述主装置的方向上向所述第一热交换器施加力; 以及至少一个第二弹簧，其可操作以在所述次级装置的方向上向所述第二热交换器施加力。 一种方法，包括将被动热交换器放置在多芯片封装上，以及使弹簧偏转以在所述封装上的至少一个次级装置的方向施加力。

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