公开(公告)号：US20160307869A1

公开(公告)日：2016-10-20

申请号：US15196866

申请日：2016-06-29

Applicant: INTEL CORPORATION

Inventor： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, JR. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768 ,  H01L25/065

CPC classification number: H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

Abstract translation: 本公开的实施例涉及用于集成电路（IC）封装的芯片粘合膜，以及用于形成和去除模具粘合剂膜和封装组件的方法以及结合这种模具粘合剂膜的系统。 模具粘合剂膜可以对第一波长的光是透明的，并且对第二波长的光进行光反应。 在一些实施例中，模具粘合剂膜可以施加到模具的背面或“非活性”侧，并且模具表面可以通过模具粘合剂膜检测。 模具粘合剂膜可以用具有第二波长的光的激光能量固化和/或标记。 模具粘合剂膜可以包括被配置为提供激光标记对比度的热变色染料和/或纳米颗粒。 可以使用UV激光能量去除模具粘合剂膜以暴露诸如TSV焊盘之类的底层特征。

公开(公告)号：US09412702B2

公开(公告)日：2016-08-09

申请号：US13830126

申请日：2013-03-14

Applicant: Intel Corporation

Inventor： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/544 ,  H01L21/56

CPC classification number: H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

Abstract translation: 本公开的实施例涉及用于集成电路（IC）封装的芯片粘合膜，以及用于形成和去除模具粘合剂膜和封装组件的方法以及结合这种模具粘合剂膜的系统。 模具粘合剂膜可以对第一波长的光是透明的，并且对第二波长的光进行光反应。 在一些实施例中，模具粘合剂膜可以施加到模具的背面或“非活性”侧，并且模具表面可以通过模具粘合剂膜检测。 模具粘合剂膜可以用具有第二波长的光的激光能量固化和/或标记。 模具粘合剂膜可以包括被配置为提供激光标记对比度的热变色染料和/或纳米颗粒。 可以使用UV激光能量去除模具粘合剂膜以暴露诸如TSV焊盘之类的底层特征。

公开(公告)号：US10192810B2

公开(公告)日：2019-01-29

申请号：US13930082

申请日：2013-06-28

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Rajendra C. Dias ,  Edvin Cetegen ,  Lars D. Skoglund

IPC: H01L23/22 ,  H01L23/24 ,  H01L23/485 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.

公开(公告)号：US09859248B2

公开(公告)日：2018-01-02

申请号：US15196866

申请日：2016-06-29

Applicant: INTEL CORPORATION

Inventor： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, Jr. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/544 ,  H01L21/768 ,  H01L23/498 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

公开(公告)号：US09508660B2

公开(公告)日：2016-11-29

申请号：US14618647

申请日：2015-02-10

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Emre Armagan ,  Rajendra C. Dias ,  Lars D. Skoglund

IPC: H01L29/06 ,  H01L23/00 ,  H01L23/31 ,  H01L23/12 ,  H01L21/304 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/304 ,  H01L21/563 ,  H01L23/12 ,  H01L23/3157 ,  H01L29/06 ,  H01L2224/73204

Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.

Abstract translation: 可以形成具有倒角的微电子模具，用于减小当将这种微电子管芯并入微电子封装时可能导致分层和/或破裂故障的应力。 在一个实施例中，微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上平面的倒角侧。 在另一个实施例中，微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上弯曲或弧形的倒角侧。

公开(公告)号：US20160233175A1

公开(公告)日：2016-08-11

申请号：US14618647

申请日：2015-02-10

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Emre Armagan ,  Rajendra C. Dias ,  Lars D. Skoglund

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/12 ,  H01L21/304 ,  H01L29/06 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/304 ,  H01L21/563 ,  H01L23/12 ,  H01L23/3157 ,  H01L29/06 ,  H01L2224/73204

Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.

Abstract translation: 可以形成具有倒角的微电子模具，用于减小当将这种微电子管芯并入微电子封装时可能导致分层和/或破裂故障的应力。 在一个实施例中，微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上平面的倒角侧。 在另一个实施例中，微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上弯曲或弧形的倒角侧。