Microelectronic die having chamfered corners
    5.
    发明授权
    Microelectronic die having chamfered corners 有权
    具有倒角的微电子模具

    公开(公告)号:US09508660B2

    公开(公告)日:2016-11-29

    申请号:US14618647

    申请日:2015-02-10

    Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.

    Abstract translation: 可以形成具有倒角的微电子模具,用于减小当将这种微电子管芯并入微电子封装时可能导致分层和/或破裂故障的应力。 在一个实施例中,微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上平面的倒角侧。 在另一个实施例中,微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上弯曲或弧形的倒角侧。

    MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
    6.
    发明申请
    MICROELECTRONIC DIE HAVING CHAMFERED CORNERS 有权
    具有切割角的微电脑

    公开(公告)号:US20160233175A1

    公开(公告)日:2016-08-11

    申请号:US14618647

    申请日:2015-02-10

    Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.

    Abstract translation: 可以形成具有倒角的微电子模具,用于减小当将这种微电子管芯并入微电子封装时可能导致分层和/或破裂故障的应力。 在一个实施例中,微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上平面的倒角侧。 在另一个实施例中,微电子管芯可以包括在微电子管芯的至少两个相邻侧面之间延伸的至少一个基本上弯曲或弧形的倒角侧。

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