公开(公告)号：US20210385971A1

公开(公告)日：2021-12-09

申请号：US17337342

申请日：2021-06-02

Applicant: Intel Corporation

Inventor： Aaron GORIUS ,  Michael T. CROCKER ,  Jonathan W. THIBADO ,  Matthew J. ADILETTA ,  John C. GULICK ,  Emery E. FREY

IPC: H05K7/20

Abstract: Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface.

公开(公告)号：US20240080988A1

公开(公告)日：2024-03-07

申请号：US18506951

申请日：2023-11-10

Applicant: Intel Corporation

Inventor： Todd A. HINCK ,  Michael T. CROCKER ,  Xiang LI ,  Vijaya K. BODDU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K7/1429 ,  H05K2201/10159 ,  H05K2201/10378

Abstract: A system includes a processor, such as a CPU, surrounded by high-density memory with lower profile than a standard DIMM. The low profile, high-density memory provides multiple memory channels for the processor. With the memory configuration, the system can maintain the memory configurability with increased density and increased memory channels for the processor.

公开(公告)号：US20210400813A1

公开(公告)日：2021-12-23

申请号：US17354989

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Jonathan W. THIBADO ,  Aaron GORIUS ,  Michael T. CROCKER ,  Matthew J. ADILETTA ,  John C. GULICK ,  Emery E. FREY

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/28 ,  H05K7/02

Abstract: Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.

公开(公告)号：US20220107465A1

公开(公告)日：2022-04-07

申请号：US17553053

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Ralph JENSEN ,  Michael T. CROCKER ,  Aaron GORIUS ,  Kevin P. MA

IPC: G02B6/38 ,  H04L49/25 ,  H04J14/02

Abstract: Apparatus and methods employing wormhole structures supporting ultra-high density optical routing systems. Microstructures comprising wormhole tunnels are formed in optical looms with wormhole openings arranged in patterns, such as a high-density XY grid. Optical fibers are inserted into respective wormhole tunnels, and sleeves are used to precisely align fiber ends. A rack loom comprising a wormhole backplane is fabricated in a similar manner, with wormhole openings arrayed in the same patterns. The sleeves comprise plug-receptacle sleeve pairs, where when an optical loom (or connector bar of the optical loom) face urged toward the front face of the rack loom, the plug and receptacle sleeves are mated, resulting in precise alignment of the optical fiber ends in the pairs of sleeves. Palpebral structures may also be fabricated to provide a self-cleaning function with optional lubrication. The solutions provide more than an order of magnitude improvement over current fiber connector densities, while substantially reducing costs.

公开(公告)号：US20220107741A1

公开(公告)日：2022-04-07

申请号：US17549713

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Matthew J. ADILETTA ,  Myles WILDE ,  Aaron GORIUS ,  Michael T. CROCKER ,  Paul H. DORMITZER ,  Mark A. SCHMISSEUR

IPC: G06F3/06 ,  G06F16/174 ,  G06F21/57 ,  G06F21/73 ,  G06F8/65 ,  H04L12/24 ,  H04L29/08 ,  G06F11/30 ,  G06F9/50 ,  H01R13/453 ,  G06F9/48 ,  G06F9/455 ,  H05K7/14 ,  H03M7/30 ,  H03M7/40 ,  H04L12/26 ,  H04L12/813 ,  H04L12/851 ,  G06F11/07 ,  G06F11/34 ,  G06F7/06 ,  G06T9/00 ,  H03M7/42 ,  H04L12/28 ,  H04L12/46 ,  H04L29/12 ,  G06F13/16 ,  G06F21/62 ,  G06F21/76 ,  H03K19/173 ,  H04L9/08 ,  H04L12/933 ,  G06F9/38 ,  G06F12/02 ,  G06F12/06 ,  G06T1/20 ,  G06T1/60 ,  G06F9/54 ,  G06F8/656 ,  G06F8/658 ,  G06F8/654 ,  G06F9/4401 ,  H01R13/631

Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.

公开(公告)号：US20190307014A1

公开(公告)日：2019-10-03

申请号：US16346341

申请日：2017-11-29

Applicant: INTEL CORPORATION

Inventor： Matthew J. ADILETTA ,  Myles WILDE ,  Aaron GORIUS ,  Michael T. CROCKER ,  Paul H. DORMITZER ,  Mark A. SCHMISSEUR

IPC: H05K7/14 ,  G06F13/40 ,  H04Q11/00 ,  G02B6/44

Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.