公开(公告)号：US20170176495A1

公开(公告)日：2017-06-22

申请号：US14976808

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Wen Yin ,  Anna M. Prakash ,  Teag R. Haughan ,  Dingying David Xu ,  Joaquin Aguilar-Santillan

IPC: G01R1/067 ,  C25D3/54 ,  C25D5/34 ,  C25D5/50 ,  C23C8/20 ,  C22F1/18 ,  C11D7/28 ,  C25D7/00

CPC classification number: G01R1/06761 ,  C11D11/0047 ,  C22F1/183 ,  C23C8/16 ,  C23C8/20 ,  C23C8/80 ,  C25D3/54 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00 ,  G01R1/06722

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.

公开(公告)号：US20180166313A1

公开(公告)日：2018-06-14

申请号：US15376042

申请日：2016-12-12

Applicant: Intel Corporation

Inventor： Mingzhi Dai ,  Wen Yin ,  Craig S. Dunning ,  Robert D. Callan

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/93 ,  H01L2221/68313

Abstract: Embodiments relate to a carrier tape that includes a first layer of thermoplastic elastomer (TPE) adhesive tape. The carrier tape may further include a second layer of rigid polymer with a cavity. The rigid polymer may be coupled with a surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the cavity. A die may be coupled with the TPE adhesive tape within the cavity. Other embodiments may be described and/or claimed.

公开(公告)号：US20160375653A1

公开(公告)日：2016-12-29

申请号：US14752720

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Wen Yin ,  Dingying Xu ,  Luyin Zhao

IPC: B32B7/12 ,  B32B37/12

CPC classification number: B32B7/12 ,  B32B3/10 ,  B32B3/30 ,  B32B7/05 ,  B32B7/06 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B37/12 ,  B32B38/06 ,  B32B2250/44 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2309/10 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318

Abstract: Die transport apparatus and methods are disclosed herein. In some embodiments, a die transport apparatus may include: a plurality of regularly arranged adhesive areas, wherein individual adhesive areas have a die contact surface; and a relief area recessed from the die contact surfaces. Other embodiments may be disclosed and/or claimed.

Abstract translation: 本文公开了模具输送装置和方法。 在一些实施例中，模具输送装置可以包括：多个规则排列的粘合区域，其中各个粘合区域具有模具接触表面; 以及从模具接触表面凹陷的浮雕区域。 可以公开和/或要求保护其他实施例。

公开(公告)号：US10168357B2

公开(公告)日：2019-01-01

申请号：US14976808

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Wen Yin ,  Anna M. Prakash ,  Teag R. Haughan ,  Dingying David Xu ,  Joaquin Aguilar-Santillan

IPC: G01R1/067 ,  C25D3/54 ,  C25D7/00 ,  C25D5/50 ,  C23C8/20 ,  C22F1/18 ,  C25D5/34 ,  C11D11/00

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.