公开(公告)号：US20180108229A1

公开(公告)日：2018-04-19

申请号：US15820620

申请日：2017-11-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Phillip Duane ISAACS

IPC: G08B13/12 ,  H05K1/02 ,  H05K1/18 ,  G01N27/20

CPC classification number: G08B13/128 ,  G01N27/205 ,  H05K1/0275 ,  H05K1/0296 ,  H05K1/182 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor over time for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).

公开(公告)号：US20180096173A1

公开(公告)日：2018-04-05

申请号：US15819540

申请日：2017-11-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG ,  Michael T. PEETS

IPC: G06F21/87 ,  H05K5/02 ,  H05K5/03 ,  H01R12/59 ,  G06F21/75 ,  H05K1/02

CPC classification number: G06F21/87 ,  G06F21/75 ,  H01R12/59 ,  H05K1/0275 ,  H05K5/0208 ,  H05K5/03 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US20170108543A1

公开(公告)日：2017-04-20

申请号：US14886179

申请日：2015-10-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Edward N. COHEN ,  Phillip Duane ISAACS

IPC: G01R31/02 ,  G01R3/00

CPC classification number: H05K3/10 ,  G06F21/00 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09263

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.

公开(公告)号：US20170094804A1

公开(公告)日：2017-03-30

申请号：US15249671

申请日：2016-08-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG ,  Michael T. PEETS

IPC: H05K3/10

CPC classification number: G06F21/87 ,  G06F21/75 ,  H01R12/59 ,  H05K1/0275 ,  H05K5/0208 ,  H05K5/03 ,  H05K2201/055 ,  H05K2201/056

Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US20170094784A1

公开(公告)日：2017-03-30

申请号：US14865632

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Phillip Duane ISAACS ,  David C. LONG

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/09 ,  H05K7/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US20180365945A1

公开(公告)日：2018-12-20

申请号：US16048622

申请日：2018-07-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Phillip Duane ISAACS ,  William SANTIAGO-FERNANDEZ

IPC: G08B13/12

CPC classification number: G08B13/12 ,  G08B13/128

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

公开(公告)号：US20180070444A1

公开(公告)日：2018-03-08

申请号：US15800497

申请日：2017-11-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Phillip Duane ISAACS ,  David C. LONG

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/30 ,  H05K3/12 ,  H05K7/02 ,  H05K1/09 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/09 ,  H05K1/183 ,  H05K3/12 ,  H05K3/30 ,  H05K3/301 ,  H05K3/46 ,  H05K5/0208 ,  H05K7/023 ,  H05K2201/015 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

公开(公告)号：US20170091492A1

公开(公告)日：2017-03-30

申请号：US14865572

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG ,  Michael T. PEETS

IPC: G06F21/87 ,  H05K5/03 ,  H01R12/59

CPC classification number: G06F21/87 ,  G06F21/75 ,  H01R12/59 ,  H05K1/0275 ,  H05K5/0208 ,  H05K5/03 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US20180365947A1

公开(公告)日：2018-12-20

申请号：US16048650

申请日：2018-07-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Phillip Duane ISAACS ,  William SANTIAGO-FERNANDEZ

IPC: G08B13/12

CPC classification number: G08B13/12 ,  G08B13/128

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

公开(公告)号：US20170116830A1

公开(公告)日：2017-04-27

申请号：US14918691

申请日：2015-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Phillip Duane ISAACS

IPC: G08B13/12

CPC classification number: G08B13/128

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an inner enclosure, a tamper-respondent sensor(s), a protective wrap(s) and an outer enclosure. The inner enclosure is sized to receive one or more electronic components to be protected, and the tamper-respondent sensor(s) wraps around the inner enclosure. The protective wrap(s) overlies and wraps around the tamper-respondent sensor(s) and inner enclosure, and together the inner enclosure, tamper-respondent sensor(s), and protective wrap(s) form a tamper-respondent subassembly. The outer enclosure receives and surrounds, at least in part, the tamper-respondent subassembly, with the tamper-respondent sensor(s) and protective wrap(s) disposed between the inner enclosure and the outer enclosure. When operative, the inner enclosure, tamper-respondent sensor(s), protective wrap(s) and outer enclosure are coupled together and facilitate conduction of heat from the electronic component(s) out to the outer enclosure.