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1.发明授权Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices 有权散热器，散热器封装以及与倒装芯片半导体器件一起使用的制造方法公开(公告)号：US06775140B2
公开(公告)日：2004-08-10
申请号：US10434256
申请日：2003-05-07
IPC分类号： H05K720
CPC分类号： H01L23/36 , H01L21/4878 , H01L23/3128 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/3025
摘要： A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.
摘要翻译： 一种从整体金属材料制造半导体器件散热器的方法。 金属材料被冲压以形成具有上部散热区域，下部基板接触区域和连接上部散热区域和下部基板接触区域的支撑件的整体散热器。 在支撑件和上部和下部区域中形成凹部以接收半导体器件。
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公开(公告)号：US07575956B2
公开(公告)日：2009-08-18
申请号：US10721916
申请日：2003-11-24
IPC分类号： H01L21/44
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制造半导体散热器的方法。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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公开(公告)号：US08207598B2
公开(公告)日：2012-06-26
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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公开(公告)号：US20090273062A1
公开(公告)日：2009-11-05
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/552 , H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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公开(公告)号：US07786593B2
公开(公告)日：2010-08-31
申请号：US11760690
申请日：2007-06-08
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L29/0657 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73257 , H01L2224/73265 , H01L2225/06506 , H01L2225/06555 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , H01L2924/00015 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
摘要翻译： 提供一种集成电路管芯，其具有主体部分，该主体部分具有单个侧面和从本体部分延伸的基座部分，并且具有与本体部分的单面侧共面的单面侧。
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公开(公告)号：US07242101B2
公开(公告)日：2007-07-10
申请号：US10894561
申请日：2004-07-19
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L29/0657 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73257 , H01L2224/73265 , H01L2225/06506 , H01L2225/06555 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , H01L2924/00015 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
摘要翻译： 提供一种集成电路管芯，其具有主体部分，该主体部分具有单个侧面和从本体部分延伸的基座部分，并且具有与本体部分的单面侧共面的单面侧。
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公开(公告)号：US07863730B2
公开(公告)日：2011-01-04
申请号：US10921377
申请日：2004-08-18
申请人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
发明人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
IPC分类号： H01L23/367 , H01L21/98
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01033 , H01L2924/01079 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.
摘要翻译： 公开了一种形成散热器的方法和由此形成的散热器。 形成具有多个连接的散热板的阵列散热器。 狭槽形成在散热板的相对侧。 在散热器面板上的至少一对相对的槽中，每个散热板上都形成有腿。 腿与它们依赖的相应散热器面板是一体的。
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8.发明申请公开(公告)号：US20110233744A1
公开(公告)日：2011-09-29
申请号：US13154308
申请日：2011-06-06
申请人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
发明人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
IPC分类号： H01L23/495 , H01L21/60 , H01L21/98
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3107 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.
摘要翻译： 一种用于制造集成电路封装系统的方法，包括：提供引线框架; 在引线框上形成突出的焊盘; 将模具附接到引线框架; 将管芯电连接到引线框架; 并且将引线框，突出垫和模具的至少一部分封装在密封剂中。
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公开(公告)号：US20070063322A1
公开(公告)日：2007-03-22
申请号：US11162785
申请日：2005-09-22
申请人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
发明人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
IPC分类号： H01L23/02
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3107 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.
摘要翻译： 提供集成电路封装系统。 突起垫形成在引线框架上。 裸片附着在引线框架上。 模具电连接到引线框架。 引线框架，突出焊盘和管芯的至少一部分被封装在密封剂中。
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公开(公告)号：US07064430B2
公开(公告)日：2006-06-20
申请号：US10931919
申请日：2004-08-31
申请人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
发明人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
IPC分类号： H01L23/34
CPC分类号： H01L25/50 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2924/19041 , H01L2924/19103 , H01L2924/19105 , H01L2924/30107 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.
摘要翻译： 半导体封装包括衬底。 锯齿状间隔件连接到基底。 至少一个顶模连接到锯齿状间隔物。 所述至少一个顶部管芯被引线接合到所述基板上，并且在所述锯齿状间隔件和所述至少一个顶部模具之上形成密封剂。
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