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公开(公告)号：US10317512B2
公开(公告)日：2019-06-11
申请号：US14954395
申请日：2015-11-30
IPC分类号： G01S7/03 , G01S7/00 , G01S13/00 , G01S13/34 , G01S13/87 , G01S7/35 , G01S13/58 , G01S13/93 , H01Q9/04 , H01Q19/30 , H01L23/66 , G01S13/02
摘要： In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
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公开(公告)号：US20220148951A1
公开(公告)日：2022-05-12
申请号：US17544221
申请日：2021-12-07
发明人： Ngoc-Hoa Huynh , Franz-Xaver Muehlbauer , Claus Waechter , Veronika Theyerl , Dominic Maier , Thomas Kilger , Saverio Trotta , Ashutosh Baheti , Georg Meyer-Berg , Maciej Wojnowski
IPC分类号： H01L23/498 , H01L23/367 , H01L23/538 , H01Q9/28 , H01Q1/22 , H01Q9/04 , H01Q21/06 , H01L21/56 , H01L23/31
摘要： A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
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公开(公告)号：US20190113601A1
公开(公告)日：2019-04-18
申请号：US16218771
申请日：2018-12-13
IPC分类号： G01S7/03 , G01S13/00 , G01S13/34 , G01S13/87 , G01S7/35 , H01Q9/04 , G01S13/58 , G01S13/93 , G01S7/00 , H01Q19/30 , H01L23/66
CPC分类号： G01S7/032 , G01S7/006 , G01S7/038 , G01S7/354 , G01S13/003 , G01S13/343 , G01S13/584 , G01S13/87 , G01S13/931 , G01S2013/0245 , H01L23/66 , H01L25/00 , H01L2223/6677 , H01L2224/12105 , H01L2224/16227 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H01Q9/0407 , H01Q19/30
摘要： In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
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公开(公告)号：US10408919B2
公开(公告)日：2019-09-10
申请号：US16218771
申请日：2018-12-13
IPC分类号： G01S7/03 , G01S7/00 , G01S13/00 , G01S13/34 , G01S13/87 , G01S7/35 , G01S13/58 , G01S13/93 , H01Q9/04 , H01Q19/30 , H01L23/66 , G01S13/02
摘要： In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
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公开(公告)号：US11195787B2
公开(公告)日：2021-12-07
申请号：US15045687
申请日：2016-02-17
发明人： Ngoc-Hoa Huynh , Franz-Xaver Muehlbauer , Claus Waechter , Veronika Huber , Dominic Maier , Thomas Kilger , Saverio Trotta , Ashutosh Baheti , Georg Meyer-Berg , Maciej Wojnowski
IPC分类号： H01L23/31 , H01L23/498 , H01L23/367 , H01L23/538 , H01Q9/28 , H01Q1/22 , H01Q9/04 , H01Q21/06 , H01L21/56 , H01Q9/26
摘要： A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
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公开(公告)号：US20170236776A1
公开(公告)日：2017-08-17
申请号：US15045687
申请日：2016-02-17
发明人： Ngoc-Hoa Huynh , Franz-Xaver Muehlbauer , Claus Waechter , Veronika Huber , Dominic Maier , Thomas Kilger , Saverio Trotta , Ashutosh Baheti , Georg Meyer-Berg , Maciej Wojnowski
IPC分类号： H01L23/498 , H01L23/367 , H01L21/56 , H01L23/31
CPC分类号： H01L23/49822 , H01L21/56 , H01L23/3114 , H01L23/3672 , H01L23/3677 , H01L23/49816 , H01L23/5389 , H01L2223/6677 , H01L2223/6683 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2924/18162 , H01Q1/2283 , H01Q9/0407 , H01Q9/265 , H01Q9/285 , H01Q21/061 , H01Q21/065
摘要： A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
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公开(公告)号：US20160178730A1
公开(公告)日：2016-06-23
申请号：US14954395
申请日：2015-11-30
IPC分类号： G01S7/03
CPC分类号： G01S7/032 , G01S7/006 , G01S7/038 , G01S7/354 , G01S13/003 , G01S13/343 , G01S13/584 , G01S13/87 , G01S13/931 , G01S2013/0245 , H01L23/66 , H01L2223/6677 , H01L2224/12105 , H01L2224/16227 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H01Q9/0407 , H01Q19/30
摘要： In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
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