公开(公告)号：US10347554B2

公开(公告)日：2019-07-09

申请号：US15462858

申请日：2017-03-19

Applicant: Infineon Technologies AG

Inventor： Norbert Joson Santos ,  Edward Fuergut ,  Sanjay Kumar Murugan

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/40 ,  H01L23/367 ,  H01L23/495 ,  H01L21/56 ,  H01L21/02 ,  H01L21/67 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L21/3105 ,  H01L33/58 ,  H01L33/60 ,  H01L43/02 ,  H01L23/24

Abstract: An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.

公开(公告)号：US20180211907A1

公开(公告)日：2018-07-26

申请号：US15412108

申请日：2017-01-23

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Edmund Sales Cabatbat ,  Gaylord Evangelista Cruz ,  Amirul Afiq Hud ,  Teck Sim Lee ,  Norbert Joson Santos ,  Chiew Li Tai ,  Chin Wei Yang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.

公开(公告)号：US10083899B2

公开(公告)日：2018-09-25

申请号：US15412108

申请日：2017-01-23

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Edmund Sales Cabatbat ,  Gaylord Evangelista Cruz ,  Amirul Afiq Hud ,  Teck Sim Lee ,  Norbert Joson Santos ,  Chiew Li Tai ,  Chin Wei Yang

IPC: H01L23/40 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4853 ,  H01L21/4882 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.