Abstract:
A microelectronic component (110, 120) has a contact pad (110C, 120C, 920C) recessed in a cavity (410) and covered by underfill tape (130). The cavity has a void (410V) below the underfill tape. A protruding contact pad of another microelectronic component ruptures the underfill tape to enter the cavity and bond to the recessed contact pad. The void helps in rupturing the underfill tape, thus reducing the amount of underfill residue between the two contact pads and improving the contact resistance. Also provided is a microelectronic component having a substrate with a cavity and having a through-substrate via extending into the cavity. Other features are also provided.
Abstract:
A workpiece (120) has protruding conductive features (140) at least on a first side. The second side is processed while the workpiece is held from the first side by a holder (220H). To prevent damage to the protruding features and flatten the workpiece (which could be otherwise warped), a spacer (210) is inserted between the workpiece and the holder. The spacer has holes (250) receiving the protruding features. The workpiece can be held by forces generated by the holder such as vacuum or an electrostatic force, without an adhesive. Other features and advantages are provided.
Abstract:
A workpiece (120) has protruding conductive features (140) at least on a first side. The second side is processed while the workpiece is held from the first side by a holder (220H). To prevent damage to the protruding features and flatten the workpiece (which could be otherwise warped), a spacer (210) is inserted between the workpiece and the holder. The spacer has holes (250) receiving the protruding features. The workpiece can be held by forces generated by the holder such as vacuum or an electrostatic force, without an adhesive. Other features and advantages are provided.