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    Computer assisted weak pattern detection and quantification system
    1.
    发明授权
    Computer assisted weak pattern detection and quantification system 有权

    公开(公告)号：US10740888B2

    公开(公告)日：2020-08-11

    申请号：US15275726

    申请日：2016-09-26

    Applicant: KLA-Tencor Corporation

    Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

    IPC: G06T7/00 ,  H01L21/66

    Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the identified weak patterns; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

    Self directed metrology and pattern classification
    2.
    发明授权
    Self directed metrology and pattern classification 有权

    公开(公告)号：US10483081B2

    公开(公告)日：2019-11-19

    申请号：US15247774

    申请日：2016-08-25

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Ajay Gupta ,  Jan Lauber

    IPC: H01J37/22 ,  G06K9/62 ,  G06T7/00 ,  G03F7/20 ,  G06T7/11 ,  G01N21/956 ,  G01N21/88 ,  H01L21/66

    Abstract: Methods and systems for determining parameter(s) of a process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for determining an area of a defect detected on a specimen. The computer subsystem(s) are also configured for correlating the area of the defect with information for a design for the specimen and determining a spatial relationship between the area of the defect and the information for the design based on results of the correlating. In addition, the computer subsystem(s) are configured for automatically generating a region of interest to be measured during a process performed for the specimen with a measurement subsystem based on the spatial relationship.

    Method and System for Mixed Mode Wafer Inspection
    4.
    发明申请
    Method and System for Mixed Mode Wafer Inspection 审中-公开

    公开(公告)号：US20190108630A1

    公开(公告)日：2019-04-11

    申请号：US16206691

    申请日：2018-11-30

    Applicant: KLA-Tencor Corporation

    Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

    IPC: G06T7/00

    Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

    Based device risk assessment
    5.
    发明授权
    Based device risk assessment 有权

    公开(公告)号：US10223492B1

    公开(公告)日：2019-03-05

    申请号：US14178866

    申请日：2014-02-12

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Youseung Jin ,  Sungchan Cho ,  Barry Saville

    IPC: G06F17/50 ,  G06F11/00 ,  H01J37/26

    Abstract: The process for design based assessment includes the following steps. First, the process defines multiple patterns of interest (POIs) utilizing design data of a device and then generates a design based classification database. Further, the process receives one or more inspection results. Then, the process compares the inspection results to each of the plurality of POIs in order to identify occurrences of the POIs in the inspection results. In turn, the process determines yield impact of each POI utilizing process yield data and monitors a frequency of occurrence of each of the POIs and the criticality of the POIs in order to identify process excursions of the device. Finally, the process determines a device risk level by calculating a normalized polygon frequency for the device utilizing a frequency of occurrence for each of the critical polygons and a criticality for each of the critical polygons.

    Image based specimen process control
    6.
    发明授权
    Image based specimen process control 有权

    公开(公告)号：US10181185B2

    公开(公告)日：2019-01-15

    申请号：US15402197

    申请日：2017-01-09

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Lisheng Gao ,  Ashok Kulkarni ,  Saibal Banerjee ,  Ping Gu ,  Songnian Rong ,  Kris Bhaskar

    IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95

    Abstract: Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.

    Pattern failure discovery by leveraging nominal characteristics of alternating failure modes
    9.
    发明授权
    Pattern failure discovery by leveraging nominal characteristics of alternating failure modes 有权
    通过利用交替故障模式的标称特性进行模式故障发现

    公开(公告)号：US09536299B2

    公开(公告)日：2017-01-03

    申请号：US14542430

    申请日：2014-11-14

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park

    IPC: G06T7/00 ,  H01L21/67

    CPC classification number: G06T7/001 ,  G06T2207/30148 ,  H01L21/67288

    Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. Different dies are printed on the wafer with different process conditions. The different process conditions correspond to different failure modes for the wafer. The method also includes comparing the output generated for a first of the different dies printed with the different process conditions corresponding to a first of the different failure modes with the output generated for a second of the different dies printed with the different process conditions corresponding to a second of the different failure modes opposite to the first of the different failure modes. In addition, the method includes detecting defects on the wafer based on results of the comparing step.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括获取由检查系统产生的晶片的输出。 在不同的工艺条件下在晶片上印刷不同的模具。 不同的工艺条件对应于晶片的不同故障模式。 该方法还包括将针对不同工艺条件印刷的不同模具中的第一种不同的不同模具产生的输出与对应于不同工艺条件的不同工艺条件相对应地印刷在不同模具中的第二种模具 与第一种不同故障模式相反的不同故障模式的第二种。 此外，该方法包括基于比较步骤的结果检测晶片上的缺陷。

    Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
    10.
    发明授权
    Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer 有权
    检查晶片和/或预测在晶片上形成的器件的一个或多个特性

    公开(公告)号：US08948495B2

    公开(公告)日：2015-02-03

    申请号：US13783291

    申请日：2013-03-02

    Applicant: KLA-Tencor Corporation

    Inventor： Gino Marcuccilli ,  Amir Widmann ,  Ellis Chang ,  John Robinson ,  Allen Park

    IPC: G06K9/00 ,  G06T7/00

    CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.

    Abstract translation: 提供了检查晶片和/或预测在晶片上形成的器件的一个或多个特性的方法。 一种方法包括获取用于多个印刷在晶片上的图像，每个图像通过在晶片上执行双重图案化平版印刷工艺而被印刷，并且包括两个或更多个以双重图案化平版印刷工艺的覆盖的标称值印刷的模具，以及一个或 更多地以覆盖层的调制值打印; 将以标称值印刷的多个印模获得的图像与以调制值印刷的多个印模获得的图像进行比较; 并且基于比较步骤的结果检测以调制值印刷的多个印模中的缺陷。

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