Abstract:
A method and system for overly measurement is disclosed. The overlay measurement is performed based on moiré effect observed between structured illumination grids and overlay targets. A structured illumination is used to illuminate a first overlay target and a second overlay target. Upon obtaining an image of the first overlay target illuminated by the structured illumination and an image of the second overlay target illuminated by the structured illumination, relative displacement between the first overlay target and the structured illumination and relative displacement between the second overlay target and the structured illumination are measured. The overlay between the first overlay target and the second overlay target is then measured based on their relative displacements with respect to the structured illumination.
Abstract:
Metrology targets, design files, and design and production methods thereof are provided. Metrology targets comprising at least one reflection-symmetric pair of reflection-asymmetric structures are disclosed. The structures may or may not be periodic, may comprise a plurality of unevenly-spaced target elements, which may or may not be segmented. The asymmetry may be with respect to target element segmentation or structural dimensions. Also, target design files and metrology measurements of the various metrology targets are disclosed.
Abstract:
Focusing modules and methods are provided, which use a spatial light modulator (SLM) configured to yield a circumferentially sinusoidal pattern to derive focusing signals. For example, the SLM may comprise an optical chopper wheel made of a glass disc with a circumferentially sinusoidal pattern. The circumferentially sinusoidal pattern simplifies phase derivation from the focusing signal, providing a faster and more accurate estimation of defocusing. Signal detection may be carried out by a diode array that provides a more accurate signal faster, as well as a more differentiated analysis of the focusing signal than the one available by current technology.
Abstract:
An overlay target for a semiconductor device is disclosed. The overlay measurement target includes a first ring target located on a first measured layer of the semiconductor device. The first ring target includes a plurality of detectable features arranged in a circular manner having a first circumference. The overlay measurement target also includes a second ring target located on a second measured layer of the semiconductor device. The second ring target includes a plurality of detectable features arranged in a circular manner having a second circumference different from the first circumference. The displacement between a detected center of the first ring target and a detected center of the second ring target indicates an overlay error between the first measured layer and the second measured layer.
Abstract:
Metrology targets and method of using the metrology targets for measurement of critical dimension, overlay or scanner aberration are disclosed. A target may include an unresolved grid having a plurality of lines spaced equally apart from each other according to a pre-determined pitch distance and at least one resolved feature tilted at an angle with respect to the unresolved grid. The method may indentify multiple regions of interest (ROIs) and determine a series of center points between the ROIs as the ROIs are being shifted. Critical dimension, overlay or scanner aberration may be calculated by analyzing the series of center points between the ROIs.
Abstract:
Metrology targets, design files, and design and production methods thereof are provided. Metrology targets comprising at least one reflection-symmetric pair of reflection-asymmetric structures are disclosed. The structures may or may not be periodic, may comprise a plurality of unevenly-spaced target elements, which may or may not be segmented. The asymmetry may be with respect to target element segmentation or structural dimensions. Also, target design files and metrology measurements of the various metrology targets are disclosed.
Abstract:
Scatterometry measurement systems, illumination configurations and respective methods are provided, which comprise illumination beams that have vertical projections on a target plane comprising both a parallel component and a perpendicular component, with respect to a target measurement direction. The illumination beams propagate at an angle to the plane defined by the measurement direction and a normal to the targets surface and generate diffraction images which are off-center at the imaging pupil plane. The eccentric diffraction images are spatially arranged to avoid overlaps and to correspond to measurement requirements such as spot sizes, number of required diffraction orders and so forth. The illumination beams may be implemented using illumination pupil masks, which provide a simple way to increase scatterometry measurements throughput.
Abstract:
Scatterometry measurement systems, illumination configurations and respective methods are provided, which comprise illumination beams that have vertical projections on a target plane comprising both a parallel component and a perpendicular component, with respect to a target measurement direction. The illumination beams propagate at an angle to the plane defined by the measurement direction and a normal to the targets surface and generate diffraction images which are off-center at the imaging pupil plane. The eccentric diffraction images are spatially arranged to avoid overlaps and to correspond to measurement requirements such as spot sizes, number of required diffraction orders and so forth. The illumination beams may be implemented using illumination pupil masks, which provide a simple way to increase scatterometry measurements throughput.
Abstract:
Targets, target elements and target design method are provided, which comprise designing a target structure to have a high contrast above a specific contrast threshold to its background in polarized light while having a low contrast below the specific contrast threshold to its background in non-polarized light. The targets may have details at device feature scale and be compatible with device design rules yet maintain optical contrast when measured with polarized illumination and thus be used effectively as metrology targets. Design variants and respective measurement optical systems are likewise provided.
Abstract:
Targets, target elements and target design method are provided, which comprise designing a target structure to have a high contrast above a specific contrast threshold to its background in polarized light while having a low contrast below the specific contrast threshold to its background in non-polarized light. The targets may have details at device feature scale and be compatible with device design rules yet maintain optical contrast when measured with polarized illumination and thus be used effectively as metrology targets. Design variants and respective measurement optical systems are likewise provided.