Method and system for edge-of-wafer inspection and review

    公开(公告)号:US10056224B2

    公开(公告)日:2018-08-21

    申请号:US15231728

    申请日:2016-08-08

    Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

    Method and system for defect classification

    公开(公告)号:US09898811B2

    公开(公告)日:2018-02-20

    申请号:US14749316

    申请日:2015-06-24

    Abstract: Defect classification includes acquiring one or more images of a specimen, receiving a manual classification of one or more training defects based on one or more attributes of the one or more training defects, generating an ensemble learning classifier based on the received manual classification and the attributes of the one or more training defects, generating a confidence threshold for each defect type of the one or more training defects based on a received classification purity requirement, acquiring one or more images including one or more test defects, classifying the one or more test defects with the generated ensemble learning classifier, calculating a confidence level for each of the one or more test defects with the generated ensemble learning classifier and reporting one or more test defects having a confidence level below the generated confidence threshold via the user interface device for manual classification.

    Method and System for Edge-of-Wafer Inspection and Review
    5.
    发明申请
    Method and System for Edge-of-Wafer Inspection and Review 审中-公开
    晶圆边缘检查和审查的方法和系统

    公开(公告)号:US20170047193A1

    公开(公告)日:2017-02-16

    申请号:US15231728

    申请日:2016-08-08

    Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

    Abstract translation: 用于检查或检查样品的边缘部分的电子光学系统包括被配置为产生一个或多个电子束的电子束源,被配置为固定样品的样品台和包括一组电子光学的电子 - 光学柱 被配置为将一个或多个电子束的至少一部分引导到样品的边缘部分上的元件。 该系统还包括围绕样品设置的样品位置参考装置和设置在样品边缘与样品位置参考装置之间的保护环装置,以补偿一个或多个边缘场。 保护环装置的一个或多个特性是可调节的。 该系统还包括被配置为检测从样品表面发出的电子的检测器组件。

    Method and system for edge-of-wafer inspection and review

    公开(公告)号:US10770258B2

    公开(公告)日:2020-09-08

    申请号:US16105632

    申请日:2018-08-20

    Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

    Method and System for Edge-of-Wafer Inspection and Review

    公开(公告)号:US20190006143A1

    公开(公告)日:2019-01-03

    申请号:US16105632

    申请日:2018-08-20

    Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

    Method and System for Iterative Defect Classification
    8.
    发明申请
    Method and System for Iterative Defect Classification 有权
    迭代缺陷分类方法与系统

    公开(公告)号:US20160358041A1

    公开(公告)日:2016-12-08

    申请号:US15010887

    申请日:2016-01-29

    Abstract: Defect classification includes acquiring one or more images of a specimen including multiple defects, grouping the defects into groups of defect types based on the attributes of the defects, receiving a signal from a user interface device indicative of a first manual classification of a selected number of defects from the groups, generating a classifier based on the first manual classification and the attributes of the defects, classifying, with the classifier, one or more defects not manually classified by the manual classification, identifying the defects classified by the classifier having the lowest confidence level, receiving a signal from the user interface device indicative of an additional manual classification of the defects having the lowest confidence level, determining whether the additional manual classification identifies one or more additional defect types not identified in the first manual classification, and iterating the procedure until no new defect types are found.

    Abstract translation: 缺陷分类包括获取包含多个缺陷的样本的一个或多个图像,基于缺陷的属性将缺陷分组成缺陷类型组;从用户界面装置接收指示所选择数量的缺陷的第一手动分类的信号 根据第一手工分类和缺陷属性生成分类器,用分类器分类一个或多个缺乏手动分类手段分类的缺陷,识别由具有最低置信度的分类器分类的缺陷 从所述用户界面设备接收指示对具有最低置信水平的所述缺陷进行额外手动分类的信号,确定所述附加手动分类是否识别在所述第一手动分类中未识别的一个或多个附加缺陷类型,以及迭代所述程序 直到找不到新的缺陷类型。

    Systems and methods for preparation of samples for sub-surface defect review
    9.
    发明授权
    Systems and methods for preparation of samples for sub-surface defect review 有权
    用于亚表面缺陷检查的样品的制备和方法

    公开(公告)号:US09318395B2

    公开(公告)日:2016-04-19

    申请号:US13687244

    申请日:2012-11-28

    Abstract: One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed.

    Abstract translation: 一个实施方案涉及使用扫描电子显微镜装置制备用于亚表面评价的基材的样品的方法。 重新检测在第一结果文件中指示的位置处的缺陷,并且使用至少一个相对于缺陷的位置具有预定定位的离散标记点标记缺陷的位置。 可以相对于设备的设计来确定缺陷的位置,并且可以使用该信息至少部分自动化地确定切割位置和切割角度。 另一实施例涉及一种用于准备用于子表面检查的样品的系统。 另一实施例涉及用于在目标衬底上标记用于复查的缺陷的方法。 还公开了其它实施例,方面和特征。

Patent Agency Ranking