Abstract:
A semiconductor integrated circuit includes a semiconductor chip, a plurality of first through-chip vias formed vertically through the semiconductor chip and configured to operate as an interface for a first power supply, and a first common conductive layer provided over the semiconductor chip and coupling the plurality of first through-chip vias to each other in a horizontal direction.
Abstract:
There is an internal voltage generating circuit for providing a stable high voltage by making a response time short. The internal voltage generating circuit includes a charge pump unit for generate a high voltage being higher than an external voltage in response to pumping control signals and a supply driving control signal; a pumping control signal generating unit for outputting the pumping control signals to the charge pump unit based on a driving signal; and a supply driving control unit for receiving the driving signal to generate the supply driving control signal to the charge pump unit.
Abstract:
The present invention provides voltage supplier for supplying an internal voltage with optimized drivability required for internal operation. The voltage supplier of a semiconductor memory device includes: an internal voltage detection means for detecting a voltage level of an internal voltage; a clock oscillation means for outputting a charge pumping clock signal; an internal voltage control means for controlling the clock oscillation means to be performed selectively in accordance with a data access mode or a non-data access mode; and a charge pumping means for outputting the internal voltage required for internal operation by pumping charges in response to the charge pumping clock signal.
Abstract:
An integrated circuit includes a first semiconductor chip including a plurality of first through chip vias for a first voltage and a plurality of second through chip vias for a second voltage inserted in vertical direction. A second semiconductor chip is stacked over the first semiconductor chip, and includes the plurality of first through chip vias and the plurality of second through chip vias. The plurality of first connection pads is configured to couple the first semiconductor chip to the second semiconductor chip, by coupling the corresponding first through chip vias. The plurality of second connection pads is configured to couple the first semiconductor chip to the second semiconductor chip, by coupling the corresponding second through chip vias. A first conductive line is configured to couple the plurality of first connection pads to each other, and a second conductive line is configured to couple the plurality of second connection pads to each other. An isolation layer is inserted between the first conductive line and the second conductive line.
Abstract:
An internal voltage generating circuit of a semiconductor device includes a normal reference voltage generating unit configured to generate a normal reference voltage having a constant voltage level without regard to PVT variations, a test reference voltage generating unit configured to generate a test reference voltage by dividing a voltage level between an external power supply voltage and the normal reference voltage at a set ratio, an operation reference voltage generating unit configured to generate an operation reference voltage by selecting one of the normal reference voltage and the test reference voltage in response to a test signal, and an internal voltage generating unit configured to generate an internal voltage whose voltage level is determined based on the level of the operation reference voltage.
Abstract:
A semiconductor memory device that prevents a power noise generated at a data input/output pad in a read operation from affecting a data strobe signal pad. The semiconductor memory device includes first power supply voltage pads for a data output circuit, a first power mesh, and a second power supply voltage pad for a data strobe signal output circuit. The first power mesh connects first power supply voltage pads to one another. The second power supply voltage pad is electrically separated from the first power mesh.
Abstract:
An internal voltage generating circuit is utilized to perform a TDBI (Test During Burn-in) operation for a semiconductor device. The internal voltage generating circuit produces an internal voltage at a high voltage level, as an internal voltage, in not only a standby section but also in an active section in response to a test operation signal activated in a test operation. Accordingly, dropping of the internal voltage in the standby section of the test operation and failure due to open or short circuiting are prevented. As a result, reliability of the semiconductor chip, by preventing the generation of latch-up caused by breakdown of internal circuits, is assured.
Abstract:
A negative voltage supply device includes a negative voltage detector and a negative voltage pumping unit. The negative voltage pumping unit pumps a negative voltage in response to a detection signal. The negative voltage detector detects a level of a negative voltage by using a first element and a second element, which are different in the degree of change in their respective resistance values depending on the temperature, and outputs the detection signal. The detection signal informs the negative voltage pumping unit that pumping of the negative voltage is no longer needed.
Abstract:
Embodiments of the present invention are directed to provide an internal voltage generator of a semiconductor memory device for generating a predetermined stable level of an internal voltage. The semiconductor memory device includes a control signal generator, an internal voltage generator and an internal voltage compensator. The control signal generator generates a reference signal and a compensating signal which are corresponding to voltage level of the reference signal. The internal voltage generator generates an internal voltage in response to the reference signal. The internal voltage compensator compensates the internal voltage in response to the compensating signal.