Dual Curing Polymers and Methods for Their Preparation and Use
    1.
    发明申请
    Dual Curing Polymers and Methods for Their Preparation and Use 有权
    双固化聚合物及其制备和使用方法

    公开(公告)号:US20100092690A1

    公开(公告)日:2010-04-15

    申请号:US12517211

    申请日:2007-11-07

    摘要: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译: 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式(R22SiO2 / 2)b,(R2Si03 / 2)c,(SiO4 / 2)d,(R1')f和(R23Si01 / 2)g的单元,其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Dual curing polymers and methods for their preparation and use
    2.
    发明授权
    Dual curing polymers and methods for their preparation and use 有权
    双固化聚合物及其制备和使用方法

    公开(公告)号:US08618233B2

    公开(公告)日:2013-12-31

    申请号:US12517211

    申请日:2007-11-07

    IPC分类号: C08G77/08

    摘要: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译: 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式(R22SiO2 / 2)b,(R2Si03 / 2)c,(SiO4 / 2)d,(R1')f和(R23Si01 / 2)g的单元,其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Siloxanes and Silanes Cured by Organoborane Amine Complexes
    4.
    发明申请
    Siloxanes and Silanes Cured by Organoborane Amine Complexes 有权
    硅氧烷和由有机硼烷胺络合物固化的硅烷

    公开(公告)号:US20070298223A1

    公开(公告)日:2007-12-27

    申请号:US11792063

    申请日:2005-12-13

    摘要: Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

    摘要翻译: 可固化组合物含有(i)可自由基聚合的有机硅单体,低聚物或聚合物; (ii)有机硼烷胺络合物; 任选地(iii)具有胺反应性基团的胺反应性化合物; 和(iv)当与含有活性氢和催化剂的化合物混合时能产生气体的组分。 可固化组合物可用作橡胶,胶带,粘合剂,泡沫,压敏粘合剂,保护涂层,薄膜,热塑性整体模制部件,热固性整体模制部件,密封剂,垫圈,密封件或O形环,模具附接胶 ,盖密封剂,密封剂,灌封化合物或保形涂层。 组合物还可以用于复合制品中,例如包括电气和电子连接器的整体结合的装置和水肺潜水面罩,其中将基材与组合物一起涂布或粘合在一起并固化。

    Dual Curing Polymers and Methods for Their Preparation and Use
    9.
    发明申请
    Dual Curing Polymers and Methods for Their Preparation and Use 失效
    双固化聚合物及其制备和使用方法

    公开(公告)号:US20100069523A1

    公开(公告)日:2010-03-18

    申请号:US12517220

    申请日:2007-12-10

    IPC分类号: C08J3/28 C08G77/04 C08G77/12

    摘要: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译: 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 聚合物包括式(I),(R 22 SiO 2/2)b,(R 2 SiO 3/2)c,(SiO 4/2)d,(R 1)f和(R 23 SiO 1/2)g的单元,其中每个R 1独立地为 氧原子或二价烃基; 每个R 1独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Lithography Technique Using Silicone Molds
    10.
    发明申请
    Lithography Technique Using Silicone Molds 审中-公开
    硅胶模具的平版印刷技术

    公开(公告)号:US20070269747A1

    公开(公告)日:2007-11-22

    申请号:US11659989

    申请日:2005-08-31

    IPC分类号: G03F7/00 G03F7/004 G03F7/027

    摘要: A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.

    摘要翻译: 一种方法包括以下步骤:A)用可固化(甲基)丙烯酸酯配方填充具有图案化表面的硅氧烷模具,B)固化可固化(甲基)丙烯酸酯配方以形成图案化特征,C)将硅氧烷模具和 图案化特征,任选地D)蚀刻图案化特征,以及可选地E)重复步骤A)至D)重新使用硅酮模具。 可固化(甲基)丙烯酸酯配方含有氟官能(甲基)丙烯酸酯,(甲基)丙烯酸酯和光引发剂。