Abstract:
Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump.
Abstract:
Disclosed is a curved piezoelectric device maximizing an electrical potential of the piezoelectric material corresponding to an external mechanical stress. The curved piezoelectric device includes: a curved substrate; and a piezoelectric material provided on one surface or both surfaces of the curved substrate, wherein when a stress is applied, a neutral plane in which a compressive stress and a tensile stress are balanced is located in the curved substrate, wherein the location of the neutral plane is determined by y1 and y2 of Equation 1 or 2 below, and wherein the location of the neutral plane is controllable by adjusting a thickness (d), a sectional area (A) and a Young's modulus (E) of each of the curved substrate and the piezoelectric material: wherein y 1 = E 2 d 2 ( d 1 + d 2 ) 2 ( E 1 d 1 + E 2 d 2 ) , y 2 = E 1 d 1 ( d 1 + d 2 ) 2 ( E 1 d 1 + E 2 d 2 ) and Equation 1 y 1 = E 2 A 2 ( A 1 + A 2 ) 2 ( E 1 A 1 + E 2 A 2 ) , y 2 = E 1 A 1 ( A 1 + A 2 ) 2 ( E 1 A 1 + E 2 A 2 ) . Equation 2
Abstract:
Provided is an oxide electronic device, including: an oxide substrate; an oxide thin film layer formed on the oxide substrate and containing an oxide that is heterogeneous with respect to the oxide substrate; and a ferroelectric layer formed on the oxide thin film layer and controlling electric conductivity of two-dimensional electron gas (2DEG) generated at an interface between the oxide substrate and the oxide thin film layer. Provided also is a method for manufacturing an oxide electronic device, including: depositing, on an oxide substrate, an oxide that is heterogeneous with respect to the oxide substrate to form an oxide thin film layer; and forming a ferroelectric layer on the oxide thin film layer, wherein the ferroelectric layer controls electric conductivity of 2DEG generated at an interface between the oxide substrate and the oxide thin film layer.
Abstract:
Provided are a hydrophobic antireflective substrate, a method for manufacturing the same, and a solar cell module including the same. The hydrophobic antireflective substrate includes: a substrate; a nanostructured layer having nanostructured portions formed on the substrate and nanoporous portions formed between the nanostructured portions; and a hydrophobic coating film formed on the nanostructured portions. The method for manufacturing a hydrophobic antireflective substrate includes: forming a nanostructured layer having nanostructured portions and nanoporous portions formed between the nanostructured portions on a substrate; and forming a hydrophobic coating film on the nanostructured portions. In the hydrophobic antireflective substrate disclosed herein, a porous nanostructured layer is formed on the substrate and a hydrophobic coating film is formed on the nanostructured layer, so that the hydrophobic antireflective substrate has ultra-hydrophobic property corresponding to a large water droplet contact angle.
Abstract:
A method of fabricating a cathode for a thin film battery includes depositing a cathode active material on a substrate, and crystallizing the cathode active material by irradiating laser onto the cathode active material. The cathode active material may be deposited on the substrate at normal temperature, and a light and easily processable polymer substrate may be used by crystallizing the cathode active material at low temperature using laser. A thin film battery including the cathode fabricated by the above method has excellent charging/discharging characteristics such as high discharge capacity.
Abstract:
The present disclosure provides a gas sensor including: a substrate; an electrode formed on the substrate; and a gas-sensing layer formed on the electrode, wherein the gas-sensing layer is a self-heating nanocolumnar structure having nanocolumns formed on the electrode and inclined with respect to the electrode with an angle of 60-89° and gas diffusion pores formed between the nanocolumns. The gas sensor according to the present disclosure requires no additional heater since it self-heats owing to the nanocolumnar structure and exhibits superior gas sensitivity even when no heat is applied from outside. Also, it can be mounted on mobile devices such as mobile phones because it consumes less power.
Abstract:
Disclosed are a transparent conductive composition including a material of the following formula, a target, a transparent conductive thin film using the target, and a method for fabricating the same. The disclosed transparent conductive composition and transparent conductive thin film have superior conductivity (low resistivity) and high light transmittance. Especially, they may be usefully applied for the flexible electronic devices, which may be called the core of the future display industry, because they have low resistivity of not greater than 10−3 Ω·cm and a high light transmittance of at least 90% even when deposition is carried out at room temperature. AlxZn1-xO In the above formula, x is within the range of 0.04≦x≦0.063.
Abstract translation:公开了一种透明导电组合物及其制造方法,该导电组合物包括下式的材料,靶材,使用该靶材的透明导电薄膜。 所公开的透明导电组合物和透明导电薄膜具有优异的导电性(低电阻率)和高透光率。 特别地,它们可以有用地应用于可能被称为未来显示器行业的核心的柔性电子器件,因为它们具有不大于10-3Ω·cm的低电阻率和至少90%的高透光率 即使在室温下进行沉积也是如此。 AlxZn1-xO在上式中,x在0.04 @ x @ 0.063的范围内。